Stacked Switch Module Layout for Temperature and Current Sensing
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Solution Overview
Problem
Existing power supply devices lack effective configurations for detecting physical quantities, such as temperature and current, of semiconductor devices mounted on thick plate portions, which can lead to overheating and overcurrent issues.
Innovation Solution
An electric apparatus is designed with a first stacked body containing a first semiconductor chip with a switch and a temperature sensor, and a second stacked body with a second semiconductor chip and a current sensor, where the second stacked body has higher heat dissipation properties, allowing for the detection of temperature and current through these switches.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a temperature sensor is provided in the first stacked body to detect temperature of the first switch, then temperature detection capability is improved, but device complexity increases
Solution Approach 1:
The device is divided into two separate stacked bodies: the first stacked body contains the temperature sensor for detecting temperature of the first switch, while the second stacked body contains the current sensor for detecting current of the second switch. This segmentation allows each sensor to be optimally positioned in its own stacked body, improving measurement capability while organizing device complexity into manageable modules.
Solution Approach 2:
The patent introduces separate sensor components (temperature sensor and current sensor) as intermediary elements that mediate between the semiconductor switches and the control system. These sensors act as intermediaries to detect physical quantities and transmit information without directly interfering with the switching operations, thereby improving measurement precision while maintaining operational independence.
2Measurement precision
If a current sensor is provided in the second stacked body to detect current flowing through the second switch, then current detection capability is improved, but device complexity increases
Solution Approach 1:
The device is divided into two separate stacked bodies: the first stacked body contains the temperature sensor for detecting temperature of the first switch, while the second stacked body contains the current sensor for detecting current of the second switch. This segmentation allows each sensor to be optimally positioned in its own stacked body, improving measurement capability while organizing device complexity into manageable modules.
Solution Approach 2:
The patent introduces separate sensor components (temperature sensor and current sensor) as intermediary elements that mediate between the semiconductor switches and the control system. These sensors act as intermediaries to detect physical quantities and transmit information without directly interfering with the switching operations, thereby improving measurement precision while maintaining operational independence.
3Temperature
If the second stacked body has higher heat dissipation property than the first stacked body, then heat dissipation efficiency is improved, but thermal management complexity increases
Solution Approach 1:
The patent applies local quality by assigning different heat dissipation properties to different stacked bodies based on their specific thermal requirements. The second stacked body is designed with higher heat dissipation property (through larger heat dissipation area or better thermal conduction) to handle the thermal load of the second switch, while the first stacked body has standard heat dissipation characteristics. This localized optimization improves overall heat dissipation efficiency without requiring uniform complex thermal management across the entire device.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables effective temperature and current detection, preventing overheating and overcurrent, enhancing protection functions and reducing the size of the switch module by sharing signal terminals, while maintaining efficient heat dissipation.
Implementation Method 1
a temperature sensor provided in the first stacked body to detect a temperature of the first switch
Implementation Method 2
a current sensor provided in the second stacked body to detect a current flowing through the second switch
Implementation Method 3
The second stacked body has a heat dissipation property higher than that of the first stacked body
Data Source
AI summary
An electric apparatus includes: a first stacked body in which a first semiconductor chip having a first switch is stacked on a first mounting portion; a second stacked body in which a second semiconductor chip having a second switch is stacked on a second mounting portion; a temperature sensor provided in the first stacked body to detect a temperature of the first switch; and a current sensor provided in the second stacked body to detect a current flowing through the second switch. The second stacked body has a heat dissipation property higher than that of the first stacked body.