Stacked Symmetric PCBs With Bypass Features
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Solution Overview
Problem
There is a need for improved arrangements of stacked printed circuit boards to achieve high density and accommodate various form factors, as existing technologies lack efficient methods for connecting and assembling PCBs in a way that maximizes circuit density and flexibility.
Innovation Solution
The solution involves a printed circuit board (PCB) with a connector extending from its surface and a bypass feature that allows a second copy of the PCB to be assembled, either rotated or flipped relative to the first, enabling electrical connections through the bypass feature of the first PCB, thereby facilitating high-density stacking and versatile form factors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If multiple printed circuit boards are stacked to increase circuit density, then the quantity of circuits per unit volume increases, but the complexity of assembly and electrical connection increases
Solution Approach 1:
The invention divides the electrical connection function into two segments: connectors for direct board-to-board connection and bypass features for routing connections through the board stack. This segmentation allows different connection paths to be established independently, simplifying the overall assembly process while maintaining high circuit density.
Solution Approach 2:
The PCB design incorporates both connectors and bypass features, making the board multi-functional. The same PCB can serve as both a connection point (via connectors) and a routing path (via bypass features), reducing the need for additional dedicated components and simplifying assembly.
2Volume of moving object
If PCBs are stacked to achieve high density, then space utilization improves, but the ease of manufacturing and assembly deteriorates
Solution Approach 1:
The bypass features are pre-formed during PCB manufacturing, eliminating the need for post-assembly routing or drilling. This preliminary action ensures that high-density stacking can be achieved without adding complex assembly steps, maintaining ease of manufacture while improving space utilization.
Solution Approach 2:
The design allows PCBs to be nested in a stacked configuration where connectors and bypass features work together to establish electrical connections across multiple layers. This nesting approach maximizes space utilization while the standardized connector-bypass interface simplifies the assembly process.
3Reliability
If connectors are added to enable PCB stacking, then electrical connectivity between boards is achieved, but the device complexity increases
Solution Approach 1:
The invention merges the connector function with the bypass feature into an integrated electrical connection system. The bypass feature acts as an extension of the connector, allowing the same structural element to serve both as a connection interface and a routing path, thereby reducing overall device complexity while maintaining reliable electrical connectivity.
Solution Approach 2:
The bypass feature serves as an intermediary element that facilitates electrical connection between PCBs without requiring complex multi-component assemblies. By providing a direct routing path through the board, the bypass feature simplifies the connection mechanism while ensuring reliable electrical connectivity across the stack.
Data Source
AI summary
A printed circuit board (PCB) is provided. The PCB includes a connector extending from a surface of the PCB and a bypass feature extending through the PCB. The PCB is constructed so that a first copy of the PCB is configured to be assembled to a second copy of the PCB with the second copy rotated and/or flipped relative to the first copy. An electrical connection to the first copy is accessible via the connector of the first copy, and an electrical connection to the second copy is accessible via the connector of the second copy through the bypass feature of the first copy.