Stacked Thermal Chamber Modules Using Remote Radiative Heating
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Solution Overview
Problem
The increasing complexity of integrated circuits (ICs) and the need for higher chip output density in semiconductor manufacturing are constrained by the physical size and cost of thermal processing tools, which are often limited by the use of local heat sources that require larger process chambers.
Innovation Solution
A stacked thermal process chamber module using remote radiative heating with external electromagnetic radiation generators, such as microwaves, allows for a compact design with minimal footprint, enabling efficient and selective heating of semiconductor device workpieces while reducing the thermal mass and cross-talk between chambers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If local heat sources (resistively heated pedestal or IR heat lamp) are used for thermal processing, then effective heating of workpieces is achieved, but the process chamber size and platform footprint are significantly increased
Solution Approach 1:
The heat source is extracted from the process chamber and placed remotely outside the chamber. Electromagnetic radiation generators are positioned external to the process chamber, and electromagnetic radiation is transmitted through waveguides into the chamber to heat workpieces, eliminating the need for local heating elements within the chamber space.
Solution Approach 2:
Electromagnetic radiation serves as an intermediary to transfer energy from the remote heat source to the workpiece. The radiation generators produce electromagnetic energy that travels through waveguides and couples to the workpiece materials, enabling heating without direct physical contact or proximity between the heater and workpiece.
2Reliability
If local heat sources are used in close proximity to workpieces, then thermal curing is effective, but the cost of ownership increases due to larger chamber and platform requirements
Solution Approach 1:
By extracting the heat source from the process chamber and placing it remotely, the chamber size is reduced, which directly decreases the platform footprint and associated costs while maintaining thermal processing effectiveness through electromagnetic radiation coupling.
3Productivity
If multiple thermal process chambers are stacked vertically, then IC chip output density increases, but thermal cross-talk between chambers increases with local heat sources
Solution Approach 1:
Removing heat sources from the chambers eliminates the primary source of thermal cross-talk. Each chamber receives electromagnetic radiation from external generators, preventing heat generation in chamber walls and structures that would otherwise conduct thermal energy to adjacent chambers in a stacked configuration.
4Temperature
If local heat sources are used, then workpieces can be heated effectively, but the thermal mass of the system increases
Solution Approach 1:
Extracting the heat source from the chamber removes the heavy thermal mass of local heating elements and their supporting structures. The remote electromagnetic radiation generators are positioned outside the chamber, reducing the thermal mass within the processing system while maintaining heating capability through radiation coupling.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach increases IC output density, minimizes the cost of ownership, and improves heating efficiency by allowing for concurrent processing of multiple workpieces with precise temperature control and reduced power consumption.
Implementation Method 1
A first end of each waveguide is coupled to an output of individual ones of the generators, and a second end of each waveguide terminates at individual ones of the process chambers... to contain a single one of the workpieces within a chamber interior during a thermal process
Implementation Method 2
The thermal process module includes a plurality of electromagnetic wave generators external of the stack of process chambers
Data Source
AI summary
Stacked thermal process chamber module for remote radiative heating of semiconductor device workpieces. A stacked thermal process module may include a stack of thermal process chambers and one or more generators of electromagnetic radiation. The electromagnetic radiation may be transported from a generator remote from the process chambers through one or more waveguides, thereby minimizing the volume and/or cleanroom footprint of the stacked thermal process chamber module. A waveguide may terminate in a process chamber so that electromagnetic radiation delivered during a thermal process may be coupled into one or more materials of the workpiece. The radiative heating process may overcome many of the limitations of thermal process chambers that instead employ a local heat source located within a process chamber.