Stacked Optical Transceiver Package With Plasmonic Waveguide Coupling
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Solution Overview
Problem
Current optical transceiver modules for high-speed optical communication systems face challenges with complex fabrication processes and significant optical loss, which affect their performance and efficiency.
Innovation Solution
The implementation of a manufacturing process that involves hybrid bonding and the use of plasmonic waveguides to stack photonic and storage integrated circuit components, along with a redistribution structure, to reduce optical loss and enhance data transfer rates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If conventional fabrication processes are used for optical transceiver modules, then manufacturing is simpler, but optical loss is severe and performance is poor
Solution Approach 1:
The patent combines photonic integrated circuit components and storage integrated circuit components into a single stacked package, merging optical and electrical functions in one structure. This integration reduces the number of separate components and interfaces, thereby reducing optical loss while managing the fabrication complexity through unified design
Solution Approach 2:
The patent introduces a redistribution structure as an intermediary element between the photonic and storage circuit components. This redistribution structure facilitates optimized signal routing and reduces optical loss by providing dedicated pathways for optical signals, while the complex fabrication process is managed through standardized intermediary components
2Speed
If optical transceiver modules are designed for high-speed communication, then data transfer rate increases, but optical loss and heat generation increase
Solution Approach 1:
The patent transitions from a planar layout to a three-dimensional stacked architecture, allowing optical signals to be transmitted vertically through dedicated waveguides. This dimensional change enables high-speed data transfer while reducing optical loss by providing direct, short-length optical pathways that minimize attenuation and heat generation
Solution Approach 2:
The patent segments the optical and electrical functions into separate stacked layers, with photonic components in one layer and storage components in another. This segmentation allows optimized signal routing for each function, reducing cross-interference and minimizing optical loss while maintaining high data transfer rates
3Productivity
If more transceivers are integrated in a given area, then productivity increases, but device complexity and optical loss increase
Solution Approach 1:
The patent utilizes vertical stacking to integrate multiple transceivers in a three-dimensional configuration rather than a planar arrangement. This approach increases integration density by exploiting the vertical dimension, allowing more transceivers to be packed into a given footprint while managing complexity through modular stacked design
Solution Approach 2:
The patent designs a universal stacked package structure that can accommodate multiple transceiver modules with standardized interfaces and redistribution patterns. This universality allows high integration density while reducing per-unit complexity through reuse of common structural elements and standardized fabrication processes
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in a compact, high-performance optical transceiver module with reduced signal loss and increased data transfer rates, enabling more efficient optical communication while minimizing waste heat and allowing for the integration of more transceivers within a given area.
Implementation Method 1
a plasmonic waveguide PW1 optically couples the optical input/output portion P1 of the first optical transceiver OT1, the optical input/output portion P2 of the second optical transceiver OT2, and the optical input/output portion P3 of the third optical transceiver OT3
Implementation Method 2
The implementation of a manufacturing process that involves hybrid bonding and the use of plasmonic waveguides to stack photonic and storage integrated circuit components
Data Source
AI summary
A semiconductor package includes a first optical transceiver, a second optical transceiver, a third optical transceiver, and a plasmonic waveguide. The first optical transceiver, the second optical transceiver, and the third optical transceiver are stacked in sequential order. The first optical transceiver and the third optical transceiver respectively at least one optical input/output portion for transmitting and receiving an optical signal. The plasmonic waveguide includes a first segment, a second segment, and a third segment optically coupled to one another. The first segment is embedded in the first optical transceiver. The second segment extends through the second optical transceiver. The third segment is embedded in the third optical transceiver. The first segment is optically coupled to the at least one optical input/output portion of the first optical transceiver and the third segment is optically coupled to the at least one optical input/output portion of the third optical transceiver.