Stacked Transceiver and Waveguide Launcher Layout for Low-Latency Links
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Solution Overview
Problem
Current data center interconnect technologies face limitations in achieving high bandwidth density and efficient signal transmission over medium distances due to limitations in traditional electrical fabrics and optical interconnects, which result in increased latency, power overhead, and cost, especially when dealing with high-frequency signal transmissions within data centers.
Innovation Solution
The implementation of a package assembly that includes a transceiver positioned underneath a waveguide launcher array, utilizing dielectric clad and metallic shielded dielectric waveguides to minimize signal transmission distance and increase bandwidth density, while decoupling digital and analog circuitry for independent operation, allowing for optimized performance and reduced costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If traditional electrical fabrics are used for signal transmission, then device complexity is reduced, but bandwidth density and signal transmission efficiency deteriorate
Solution Approach 1:
The patent replaces traditional electrical signal transmission systems with optical waveguide-based transmission systems. Specifically, electrical signals from the transceiver are converted to optical signals that propagate through dielectric waveguides, enabling higher bandwidth density and transmission efficiency while maintaining manageable system complexity through integrated photonic structures
Solution Approach 2:
The patent employs composite material structures, particularly dielectric waveguides with carefully engineered refractive index profiles (such as silicon nitride on silicon dioxide substrates). These composite material systems enable optimized signal confinement and transmission characteristics that achieve high bandwidth density without proportionally increasing device complexity
2Productivity
If optical interconnects are used for high-frequency signal transmission, then bandwidth density increases, but power overhead and cost increase
Solution Approach 1:
The patent segments the optical interconnect system into distinct functional modules: transceiver units, waveguide launcher arrays, and dielectric waveguide segments. This segmentation allows for optimized power consumption in each module, enables independent optimization of each component, and facilitates scalable deployment that can adapt power resources to actual bandwidth requirements
Solution Approach 2:
The patent utilizes parameter optimization in the dielectric waveguide design, including refractive index profiling, waveguide dimensions, and launch conditions. By carefully controlling these parameters, the system achieves efficient optical coupling and low-loss transmission, reducing the overall power overhead while maintaining high bandwidth density
3Length of stationary object
If signal transmission distance is increased, then connectivity range improves, but latency increases
Solution Approach 1:
The patent replaces electrical signal transmission with optical signal transmission through dielectric waveguides. Optical signals propagate at higher speeds and with lower attenuation compared to electrical signals, enabling extended transmission distances while minimizing latency through the use of low-loss waveguide materials and optimized coupling structures
4Ease of manufacture
If transceiver and waveguide launcher are positioned separately, then manufacturing ease improves, but signal transmission distance increases
Solution Approach 1:
The patent merges the transceiver and waveguide launcher array into a closely integrated stacked configuration where the transceiver is positioned directly adjacent to the waveguide launcher. This merging minimizes the signal transmission distance between components while maintaining manufacturing feasibility through standard semiconductor packaging and bonding techniques
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution achieves higher bandwidth density and optimized performance with reduced area and power consumption, minimizing latency and cost, by using dielectric clad and metallic shielded waveguides to enhance signal transmission efficiency and flexibility in data center architectures.
Implementation Method 1
utilizing dielectric clad and metallic shielded dielectric waveguides to minimize signal transmission distance
Implementation Method 2
utilizing dielectric clad and metallic shielded dielectric waveguides to minimize signal transmission distance
Implementation Method 3
utilizing dielectric clad and metallic shielded dielectric waveguides to minimize signal transmission distance
Data Source
AI summary
Embodiments herein relate to systems, apparatuses, or processes for packages that include transceivers that are at least partly positioned underneath a waveguide launcher array to decrease the maximum signal transmission time between the transceiver and the waveguide launcher array. This configuration may increase the overall data transmission rate between a die and waveguides coupled with the waveguide launcher array. Other embodiments may be described and/or claimed.