Stacked Solid-State Transducer With Integrated ESD and State Detection
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Solution Overview
Problem
Conventional SSL devices are vulnerable to electrostatic discharge (ESD) events, which can cause catastrophic damage, and they also face performance degradation due to internal heating, drive current, device age, and environmental factors, necessitating effective protection and reliable manufacturing methods.
Innovation Solution
The integration of an electrostatic discharge device and other state-sensing components, such as photosensors and thermal sensors, directly with the solid state emitter (SSE) on a common epitaxial growth substrate, forming a solid state transducer system that provides protection against ESD and monitors performance parameters.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional SSL devices are used without integrated protection devices, then manufacturing complexity is reduced, but reliability deteriorates due to vulnerability to ESD events
Solution Approach 1:
The patent combines the SSL device and ESD protection device into a single integrated structure formed on the same substrate. The protection device is formed using the same epitaxial growth substrate as the SSL device, merging two previously separate components into one unified device that provides both lighting and ESD protection functions simultaneously.
Solution Approach 2:
The integrated device structure serves multiple functions: the SSL device provides light emission while the integrated protection device provides ESD protection. This multi-functional design eliminates the need for separate protection components and their associated connection steps, resolving the contradiction between reliability improvement and complexity increase.
2Reliability
If protection diodes are connected to SSL devices using conventional approaches, then reliability against ESD is improved, but manufacturing complexity and connection steps increase
Solution Approach 1:
The protection device is merged with the SSL device at the substrate level, forming a single integrated component. This eliminates the need for separate connection steps between the SSL device and protection diode, as they are already electrically connected through the common substrate and formed in the same fabrication process.
Solution Approach 2:
The protection device is formed during the same epitaxial growth process as the SSL device, before final device assembly. This preliminary integration ensures that protection pathways are established in advance, eliminating subsequent connection steps and simplifying the manufacturing process.
3Reliability
If separate protection devices are used with SSL devices, then protection function is provided, but material costs and device complexity increase
Solution Approach 1:
The patent merges the SSL device and protection device into a single integrated structure that shares common substrate material and fabrication processes. This consolidation reduces the total quantity of materials required compared to using separate devices, as the protection device utilizes the same epitaxial layers and substrate as the SSL device rather than requiring additional separate materials.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This integrated approach enhances the reliability and manufacturability of SSL devices by reducing material costs, eliminating the need for additional connection steps, and providing effective protection against ESD and performance degradation, thereby ensuring consistent and efficient operation.
Implementation Method 1
the state device can include a photodiode, and the buffer layer can be transparent to allow light from the active region to impinge upon the photodiode
Implementation Method 2
an electrostatic discharge device can be integrated with the solid state emitter to dissipate electrostatic discharge energy
Data Source
AI summary
Solid state transducers with state detection, and associated systems and methods are disclosed. A solid state transducer system may include a support substrate that carries a solid state emitter and a state device. The solid state emitter and the state device may be stacked along a common axis. Further, the state device may be positioned to detect a state of the solid state emitter and/or an electrical path of which the solid state emitter forms a part. The solid state emitter may include a first semiconductor component, a second semiconductor component, and an active region between the first and second semiconductor components. The state device may include a state-sensing component having a composition different than that of the active region and the first and second semiconductor components. In some embodiments, the state-sensing component may include an electrostatic discharge protection device, a thermal sensor, a photosensor, or a combination thereof.