Stacked Transistor Packages for Marine Seismic Streamers
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The use of canisters to house electronics in marine seismic streamers leads to space constraints, increased costs, mechanical issues, and reliability problems due to their inflexibility, which complicates handling and deployment, and introduces stress that reduces the useful life of the streamer.
Innovation Solution
The implementation of stacked transistor packages within the streamer, eliminating the need for canisters by increasing power switching density and allowing for more efficient space utilization, thereby reducing costs and improving reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If canisters are used to house electronics in marine seismic streamers, then electronic functionality is protected, but space constraints are worsened and the streamer diameter increases
Solution Approach 1:
The patent extracts the electronics from the canister housing and integrates them directly into the streamer structure. The canister is removed entirely, and electronic components are mounted on circuit boards that are integrated into the streamer's existing structure, eliminating the need for additional space while maintaining protection through the streamer's own housing.
Solution Approach 2:
The patent merges the electronics housing function with the streamer structure itself. Instead of separate canisters, the electronics are integrated into the streamer's existing protective housing and structural elements, combining multiple functions into a unified design that reduces overall volume.
2Reliability
If canisters are used to house electronics, then electronic protection is provided, but handling and deployment become more difficult
Solution Approach 1:
The canister is extracted and removed from the design, eliminating the mechanical complexity and handling difficulties associated with rigid canister structures. This allows the streamer to be deployed and handled more easily while electronics remain protected through integration into the flexible streamer housing.
3Reliability
If canisters are used to house electronics, then electronic functionality is isolated, but the number of connections increases and reliability decreases
Solution Approach 1:
The patent merges the electronic connections with the streamer's existing signal and power pathways. By integrating electronics directly into the streamer structure, additional connection points are eliminated, and signals route through the existing streamlined connection architecture, reducing the total number of connections and potential failure points.
4Reliability
If canisters are used to house electronics, then electronic protection is provided, but costs increase
Solution Approach 1:
The expensive canister component is extracted and eliminated from the design. By removing this additional protective housing, material costs, manufacturing costs, and assembly costs are reduced, while electronics remain adequately protected through integration into the existing streamer structure.
5Power
If larger transistors are used to achieve high voltage and low power dissipation, then power performance improves, but space requirements increase
Solution Approach 1:
The patent transitions from horizontal placement of large transistor packages to vertical stacking in three-dimensional space. Multiple transistor packages are stacked vertically within the integrated electronics housing, allowing high-power transistors to be accommodated without increasing the horizontal footprint or streamer diameter.
Data Source
AI summary
Transistor packages in space-constrained applications are disclosed. An apparatus may comprise a first transistor package and a second transistor package, wherein the first transistor package is stacked upon the second transistor package. The apparatus may further comprise a cover coupled to a printed circuit board (PCB) that is configured to cover at least a portion of the stacked first and second transistor packages. The first and second transistor package may be components in a power circuit that is configured to down-convert a received voltage from a first voltage level to a second, lower voltage level.


