Stacked Voltage Regulator Module for Compact High-Speed Switching

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Solution Overview

Problem

Conventional voltage regulator modules face challenges in miniaturization and dynamic switching performance due to the large size of magnetic elements and potential detachment or shifting of components during reflow soldering processes.

Innovation Solution

A voltage regulator module design featuring a switch circuit assembly and a magnetic assembly stacked with conductive members, where the magnetic core and copper posts are embedded within the printed circuit board, and a molding compound layer encapsulates the components for enhanced heat dissipation and stability during soldering.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If the magnetic element and switch element are disposed on the same side of the printed circuit board with the switch element in the vacant space between them, then the voltage regulator module can be assembled, but the size of the magnetic element cannot be optimized and the overall size remains large

Engineering Contradiction:
Improvesize of voltage regulator moduleVSAvoidstructural optimization difficulty
Core Design Contradiction:
Volume of moving objectVSDevice complexity

Solution Approach 1:

The patent transitions from a planar layout to a three-dimensional stacked architecture. The switch element is positioned on the first surface of the printed circuit board while the magnetic element is positioned on the second surface, utilizing the Z-dimension (vertical space) to resolve spatial conflicts. This dimensional change allows both components to coexist without interfering with each other's optimization, enabling compact magnetic element design while reducing overall module size.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Ease of manufacture

If the voltage regulator module is placed on the system board for reflow soldering, then the soldering process can be completed, but the inner components may be detached or shifted

Engineering Contradiction:
Improvereflow soldering processVSAvoidcomponent stability during soldering
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The patent integrates the switch element, magnetic element, and printed circuit board into a unified stacked structure where components are vertically aligned and closely coupled. This merging creates a compact assembly with reduced thermal gradients and mechanical stresses during reflow soldering, preventing component detachment or shifting while maintaining manufacturing compatibility.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The stacked configuration inherently provides mechanical cushioning and stress distribution before the reflow soldering process. The vertical arrangement and close coupling of components create a more robust structure that can withstand thermal expansion and contraction forces during soldering, preventing detachment or shifting of inner components.

Inventive Principle:
Principle #11Beforehand cushioning (Prior cushioning)

3Ease of operation

If the central processing unit and voltage regulator module are located at the same side of the system board, then the layout is simple, but the load dynamic switching requirements cannot be met

Engineering Contradiction:
Improvelayout simplicityVSAvoiddynamic switching performance
Core Design Contradiction:
Ease of operationVSProductivity

Solution Approach 1:

The patent utilizes the vertical dimension by stacking the voltage regulator module components on opposite surfaces of the printed circuit board. This three-dimensional arrangement reduces the horizontal footprint, allowing the voltage regulator module to be positioned closer to the central processing unit without increasing board area, thereby improving dynamic switching performance while maintaining layout simplicity.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design reduces the size of the voltage regulator module, enhances dynamic switching performance, and prevents component detachment during reflow soldering, simplifying the manufacturing process while maintaining effective heat dissipation.

Implementation Method 1

a molding compound layer encapsulates the components for enhanced heat dissipation and stability during soldering

Methodology Applied
Scientific EffectHeat dissipation: Conduction (thermal)

Data Source

PatentUS11923773B2Voltage regulator module
Publication Date: 2024.03.05 DELTA ELECTRONICS INC(CN)
  • US11923773B2 patent drawing
  • US11923773B2 patent drawing
  • US11923773B2 patent drawing

AI summary

A voltage regulator module is provided. The switch circuit assembly includes two switch circuits and an input capacitor. Respective input terminals of the two switch circuits are connected with each other in parallel. The input capacitor is electrically connected with the respective input terminals of the two switch circuits in parallel and disposed between the two switch circuits. The plurality of conductive members have a first conductive member, a second conductive member and a third conductive member. The first conductive member and the third conductive member are configured to deliver an electric energy. The second conductive member is configured to deliver a signal. One end of each conductive member is electrically connected with corresponding switch circuit, and the other end of the first conductive member and the third conductive member is electrically connected with the load. The switch circuit assembly and the magnetic assembly are stacked with each other.