Stacked VRM Inductor Assembly for Low Thermal Resistance

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Solution Overview

Problem

The bottleneck of voltage regulation modules (VRM) in modern processors with low power supply voltage and high current demand is the heat dissipation, limiting the improvement of output current and efficiency.

Innovation Solution

A voltage regulator module with an inductor assembly featuring a magnetic core and windings, optimized for low thermal resistance, where the inductor and intelligent power module (IPM) unit are stacked, and the inductor winding is designed to enhance thermal connection and heat dissipation, reducing upward thermal resistance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If the output current of the voltage regulation module is increased, then the power supply capability is improved, but the heat dissipation burden increases and limits further improvement

Engineering Contradiction:
Improveoutput currentVSAvoidheat dissipation
Core Design Contradiction:
ProductivityVSTemperature

Solution Approach 1:

The patent transitions from planar arrangement to three-dimensional stacked architecture, placing the inductor directly above the IPM unit to create vertical thermal conduction paths, effectively utilizing the third dimension to improve heat dissipation while maintaining high current output capability

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The inductor serves as a thermal intermediary component, with its magnetic core and winding structure providing a thermal conduction pathway that transfers heat from the IPM unit to the heatsink, enabling efficient heat removal from the power conversion path

Inventive Principle:
Principle #24Intermediary (Mediator)

2Temperature

If the thermal connection between inductor winding and IPM unit is enhanced, then the upward thermal resistance is reduced, but the structural complexity increases

Engineering Contradiction:
Improveupward thermal resistanceVSAvoidstructural complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The patent merges the inductor and IPM unit into a single stacked assembly with integrated thermal pathways, where the inductor winding is positioned to directly contact or closely approach the IPM unit, creating unified thermal management without requiring separate complex thermal interface structures

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The inductor structure serves dual functions: electrical energy storage for power conversion and thermal conduction pathway for heat dissipation, eliminating the need for separate dedicated thermal management components and reducing overall structural complexity

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The module achieves low thermal resistance, good heat dissipation, large output current, and high conversion efficiency, addressing the heat dissipation limitations of VRM.

Implementation Method 1

heat generated by the IPM unit is transmitted to the top surface of the inductor through the magnetic material of the inductor and the winding

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

heat generated by the IPM unit is transmitted to the top surface of the inductor through the magnetic material of the inductor and the winding

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20250342995A1Inductor assembly and voltage regulator module with low thermal resistance
Publication Date: 2025.11.06 SHANGHAI METAPWR ELECTRONICS CO LTD
  • US20250342995A1 patent drawing
  • US20250342995A1 patent drawing
  • US20250342995A1 patent drawing

AI summary

A voltage regulation module with low thermal resistance is provided. The voltage regulation module includes a top inductor and a bottom assembly. The top inductor includes a magnetic core and a winding, and the winding includes a first winding and a second winding; the bottom assembly comprises a bottom substrate and an IPM unit. The first winding and the second winding both comprise a first pin and a second pin. The first pin and the second pin are both arranged on the bottom surface of the magnetic core and are electrically connected with the bottom substrate; and the inductor. The IPM unit and the bottom substrate are sequentially stacked. The upward thermal resistance of the voltage regulation module is reduced by optimally designing the shape structure of the inductor winding and optimizing the thermal connection between the inductor winding and the IPM unit.