Stacked Electrical Connector with Shielded Wafer Sub-Assemblies

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Solution Overview

Problem

Existing electrical connectors in backplane systems suffer from signal loss and signal degradation, and have a high component count, which increases manufacturing costs and is inefficient for meeting high performance demands.

Innovation Solution

The design features a stacked electrical connector with parallel contact modules, each comprising identical wafer sub-assemblies oriented 180° with respect to each other, including an overmolded leadframe and conductive shell for electrical shielding, reducing the component count and manufacturing costs while providing efficient shielding.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If traditional electrical connectors are used in backplane systems, then electrical connections between circuit boards can be achieved, but signal loss and signal degradation occur

Engineering Contradiction:
Improvesignal qualityVSAvoidsignal loss
Core Design Contradiction:
ReliabilityVSLoss of energy

Solution Approach 1:

The connector is divided into multiple contact modules stacked parallel to each other, with each module containing identical wafer sub-assemblies oriented 180° apart. This segmentation allows for optimized signal paths and shielding within each module, reducing signal degradation while maintaining connection functionality.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The conductive shell is nested around the overmolded leadframe, providing electrical shielding for the contacts. This nested configuration ensures that each contact module has integrated shielding, reducing electromagnetic interference and signal loss without requiring separate shielding components.

Inventive Principle:
Principle #7Nested doll (Nesting)

2Reliability

If traditional electrical connectors with multiple components are used, then electrical connections can be established, but manufacturing costs increase due to high component count

Engineering Contradiction:
Improveconnection stabilityVSAvoidmanufacturing cost
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

Multiple contact modules are combined into a single connector assembly with integrated shielding. Each contact module integrates the wafer sub-assemblies, overmolded leadframe, and conductive shell into one unit, reducing the overall component count and simplifying manufacturing processes while maintaining connection stability.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The conductive shell serves multiple functions: it provides electrical shielding for the contacts, structural support for the overmolded leadframe, and a mounting interface for securing contact modules to the circuit board. This multi-functionality reduces the need for separate components, lowering manufacturing costs.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Object-affected harmful factors

If traditional electrical connectors are used, then electrical connections can be made, but efficient shielding is not provided

Engineering Contradiction:
Improveelectrical interferenceVSAvoidperformance
Core Design Contradiction:
Object-affected harmful factorsVSReliability

Solution Approach 1:

The conductive shell is nested around the overmolded leadframe, creating a shielded enclosure for each contact module. This nested shielding configuration effectively blocks electrical interference from reaching the contacts, improving performance without adding external shielding components.

Inventive Principle:
Principle #7Nested doll (Nesting)

Solution Approach 2:

Each contact module has its own integrated conductive shell providing localized shielding. This local quality approach ensures that each signal path is individually protected from electromagnetic interference, providing efficient shielding tailored to each contact's specific requirements.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration reduces signal loss, enhances performance, and lowers manufacturing costs by using fewer components and molds, while maintaining effective electrical shielding across the connector.

Implementation Method 1

The shell provides electrical shielding for the contacts of the overmolded leadframe

Methodology Applied
Scientific EffectElectrical shielding: Faraday Cage

Data Source

PatentUS9455533B1Electrical connector having wafer sub-assemblies
Publication Date: 2016.09.27 TE CONNECTIVITY SOLUTIONS GMBH
  • US9455533B1 patent drawing
  • US9455533B1 patent drawing
  • US9455533B1 patent drawing

AI summary

An electrical connector includes a plurality of contact modules stacked parallel to each other within a housing. Each contact module includes a pair of wafer sub-assemblies. The wafer sub-assemblies are identical and oriented 180° with respect to each other. Each wafer sub-assembly includes an overmolded leadframe and a conductive shell holding the overmolded leadframe. The overmolded leadframe has a plurality of contacts including intermediate sections extending between mating and mounting ends. The intermediate sections are encased in an overmolded body of the overmolded leadframe. The shell has a pocket at an inner side thereof receiving the overmolded leadframe and the inner sides of the shells face each other. The shell has securing features for securing the shells together and the shell provides electrical shielding for the contacts of the overmolded leadframe.