Stacked Wafer Image Sensor Dynamic Range Extension

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Solution Overview

Problem

Conventional solid state image sensors, particularly in mobile devices, face limitations in dynamic range due to small pixel size and full well capacity, leading to loss of detail in high-contrast scenes and blooming issues, as they struggle to accurately capture both low-light and bright signals simultaneously.

Innovation Solution

The solution involves stacking two wafers, with one wafer containing an array of pixels and the other wafer equipped with counters and readout circuitry, allowing for multiple sampling of each pixel within an exposure period to extend dynamic range without increasing pixel size, thereby preventing saturation and enhancing image quality.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If pixel size is increased to improve full well capacity and dynamic range, then dynamic range is improved, but device area and complexity increase

Engineering Contradiction:
Improvedynamic rangeVSAvoidsensor area
Core Design Contradiction:
Measurement precisionVSArea of stationary object

Solution Approach 1:

The patent transitions from a planar single-wafer architecture to a three-dimensional stacked architecture with two separate wafers. The pixel array is placed on one wafer while readout circuits with counters are placed on another wafer, enabling vertical integration. This dimensional change allows independent optimization of pixel size for dynamic range while maintaining compact overall sensor area through stacking.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The sensor is divided into two functional segments on separate wafers: a pixel array wafer and a readout circuit wafer. This segmentation allows the pixel array to be optimized for light sensing with appropriate pixel size while the readout circuits are optimized for signal processing with counter elements, resolving the conflict between pixel size requirements and overall sensor area.

Inventive Principle:
Principle #1Segmentation

2Measurement precision

If multiple counters are added to extend dynamic range, then dynamic range is improved, but device complexity increases

Engineering Contradiction:
Improvedynamic rangeVSAvoidcircuit complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

By moving the counter circuits to a separate second wafer in a stacked configuration, the patent reduces in-pixel complexity while maintaining extended dynamic range functionality. The counters are distributed across the second wafer and connected to corresponding pixels through vertical interconnects, separating the complexity from the pixel array.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent implements a simplified pixel design that can be replicated across the array, with the complex counter functionality copied to corresponding locations on the second wafer. This separation allows standardization of the pixel array while distributing the complexity management to the readout circuit wafer.

Inventive Principle:
Principle #26Copying

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach effectively increases the dynamic range of solid state image sensors, preventing saturation and maintaining high resolution and frame rate, even in high-contrast scenes, by allowing multiple charge dumps and extended full well capacity without increasing pixel size, thus improving image capture capabilities.

Implementation Method 1

each of the pixels comprising a photosensor

Methodology Applied
Scientific EffectPhotoelectric Effect: Photoelectric Effect

Data Source

PatentEP3357234B1High dynamic range solid state image sensor and camera system
Publication Date: 2022.11.16 QUALCOMM INC
  • EP3357234B1 patent drawingFigure 1A
  • EP3357234B1 patent drawingFigure 1B
  • EP3357234B1 patent drawingFigure 2A

AI summary

A high dynamic range solid state image sensor and camera system are disclosed. In one aspect, the solid state image sensor includes a first wafer including an array of pixels, each of the pixels comprising a photosensor, and a second wafer including an array of readout circuits. Each of the readout circuits is configured to output a readout signal indicative of an amount of light received by a corresponding one of the pixels and each of the readout circuits includes a counter. Each of the counters is configured to increment in response to the corresponding photosensor receiving an amount of light that is greater than a photosensor threshold. Each of the readout circuits is configured to generate the readout signal based on a value stored in the corresponding counter and a remainder stored in the corresponding pixel.