Stacked Wafer-Level Package Device Integration Density
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Solution Overview
Problem
Multi-media devices require increasing amounts of integrated circuitry to support multiple apps, leading to space constraints and inefficiencies in packaging multiple semiconductor die in a compact form.
Innovation Solution
Wafer-level packaging techniques are employed to package multiple die into a single semiconductor package device using electrical interconnections and micro-solder bumps, allowing for increased density and connectivity in a smaller space, with configurations such as non-fan-out and fan-out designs to manage inputs/outputs effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If multiple semiconductor die are packaged separately, then each die can be individually tested and replaced, but the overall device occupies more space and has lower integration density
Solution Approach 1:
Multiple semiconductor die are merged into a single integrated package structure, where multiple dies are mounted on a common substrate and encapsulated together. This combining approach increases integration density by consolidating what would otherwise be separate packages into one unified device, reducing the total number of discrete components while maintaining individual die functionality.
Solution Approach 2:
The package substrate serves multiple functions simultaneously: it provides mechanical support for multiple dies, establishes electrical interconnections between dies, provides a common mounting interface, and enables signal routing between different die. This multi-functionality resolves the contradiction by consolidating several separate functions into a single universal package structure.
2Adaptability or versatility
If more integrated circuitry is added to support multiple apps, then device functionality increases, but the physical space required increases
Solution Approach 1:
The package structure utilizes three-dimensional spatial arrangement by stacking multiple dies vertically on a common substrate rather than arranging them in a single plane. This dimensional transition from 2D to 3D packaging allows more circuitry to be packed into a smaller footprint area, enabling increased device functionality without proportionally increasing the physical space occupied.
Solution Approach 2:
Multiple semiconductor die are nested within a single package enclosure, with each die contained within the same protective package structure. This nesting approach allows multiple functional units to coexist in a compact arrangement, increasing the amount of integrated circuitry that can be housed within a given physical space while maintaining individual die integrity and functionality.
3Quantity of substance
If wafer-level packaging is used to increase density, then space efficiency improves, but manufacturing precision requirements increase
Solution Approach 1:
Multiple semiconductor die are mounted on the package substrate in a predetermined arrangement before final encapsulation. This preliminary positioning allows for precise alignment to be established early in the manufacturing process, ensuring that subsequent encapsulation and interconnection steps can proceed with accurate spatial relationships between dies, thereby managing precision requirements through advance planning and positioning.
Solution Approach 2:
The package substrate acts as an intermediary element between multiple semiconductor die and the final encapsulated structure. This intermediate substrate provides a stable, precisely controllable platform that facilitates accurate positioning and alignment of multiple dies during assembly, while also serving as the basis for subsequent encapsulation processes. The substrate mediates the precision requirements by providing a reference framework that simplifies the alignment of multiple components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables a higher density of semiconductor functionality in a smaller physical space, supporting a greater number of apps and improving electrical connectivity between semiconductor package devices and the carrier device, thereby enhancing the performance and efficiency of multi-media devices.
Implementation Method 1
The semiconductor package device(s) include one or more micro-solder bumps. When a semiconductor package device is positioned over the semiconductor device, each of the micro-solder bumps are connected to a respective electrical interconnection that are formed in the semiconductor device.
Data Source
AI summary
Wafer-level package devices are described that include multiple die packaged into a single wafer-level package device. In an implementation, a wafer-level package device includes a semiconductor device having at least one electrical interconnection formed therein. At least one semiconductor package device is positioned over the first surface of the semiconductor device. The semiconductor package device includes one or more micro-solder bumps. The wafer-level package device further includes an encapsulation structure disposed over and supported by the semiconductor device for encapsulating the semiconductor package device(s). When the semiconductor package device is positioned over the semiconductor device, each micro-solder bump is connected to a respective electrical interconnection that is formed in the semiconductor device.