Stacked Modular Wireless Sensor Device Size Reduction
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Solution Overview
Problem
Current electronic devices used in wireless communication systems, particularly in wireless sensor networks, face challenges in reducing size while maintaining functionality and efficiency, especially in achieving compact designs that are unobtrusive for personal carrying without compromising performance.
Innovation Solution
The design incorporates a modular structure with a stacked configuration of two wiring boards, where one board houses the sensor module and the other the wireless communication unit, allowing for a separation of components that reduces the overall size and complexity, enabling easier customization and cost reduction by sharing common wireless communication units across different sensor configurations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If components are integrated into a single unit, then device functionality is maintained, but device size increases
Solution Approach 1:
The device is divided into separate sensor module and wireless communication unit that can be independently designed and manufactured. The sensor module includes sensor and first wiring board, while the wireless communication unit includes wireless communication circuit and second wiring board with antenna. This segmentation allows each module to be optimized independently and reduces overall device size by eliminating unnecessary integration complexity.
Solution Approach 2:
The patent implements a nested configuration where the sensor module and wireless communication unit are stacked in the thickness direction with overlapping planar positions. The first wiring board and second wiring board are arranged in a stacked manner, with the antenna extending from the wireless communication unit. This nesting approach maximizes space utilization while maintaining compact device dimensions.
2Ease of manufacture
If custom wireless communication units are created for each sensor configuration, then device performance is optimized, but manufacturing cost increases
Solution Approach 1:
The wireless communication unit is designed as a universal module that can be shared across different sensor configurations. The second wiring board and wireless communication circuit are standardized to work with multiple types of sensors, eliminating the need for custom communication units for each sensor type. This reduces manufacturing costs while maintaining reliable performance through standardized interfaces and protocols.
3Volume of moving object
If antenna is positioned close to wireless communication unit, then device size is reduced, but antenna characteristics deteriorate
Solution Approach 1:
The antenna is positioned on the surface of the second wiring board, extending in a direction parallel to the stacking direction of the wiring boards. This spatial arrangement in the third dimension (thickness direction) allows the antenna to be close to the wireless communication unit for compact device size while maintaining adequate separation to avoid interference, thus preserving antenna characteristics.
Data Source
AI summary
To achieve the reduction in size of an electronic device. The electronic device serving as an element of a wireless communication system includes a module unit, a battery that supplies electric power to the module unit, and a coupling part that electrically couples the module unit and the battery. The module unit includes a sensor that detects a physical quantity, and a wireless communication unit configured to transmit the data based on an output signal from the sensor.