Stacked X-Ray Sensing Panel Layout for Higher Fill Factor
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Solution Overview
Problem
X-ray devices face challenges in achieving high image quality due to current leakage and reduced fill factor of light sensing components, as the fill factor is compromised when the light sensing and switch components are positioned adjacent to each other without overlapping, limiting the effective area of the photoelectric conversion layer.
Innovation Solution
The X-ray device incorporates a sensing panel with a substrate, a first pixel that includes a light sensing component and a switch component, where the switch component is placed between the scintillator layer and the light sensing component, allowing for a larger photoelectric conversion layer area and reduced current leakage, thereby enhancing the fill factor.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the light sensing component and switch component are disposed adjacent to each other without overlapping, then the current leakage is reduced, but the fill factor of the light sensing component is reduced
Solution Approach 1:
The patent applies dimensional change by transitioning from a planar arrangement to a three-dimensional stacked architecture. The switch component is positioned vertically above the light sensing component rather than adjacent to it, utilizing the vertical dimension (Z-axis) to resolve the spatial conflict. This allows both components to occupy overlapping horizontal footprints without physical interference, thereby increasing the fill factor while maintaining electrical isolation to prevent current leakage.
2Area of stationary object
If the area of the photoelectric conversion layer is increased, then the fill factor is improved, but the current leakage increases
Solution Approach 1:
The patent introduces an intermediary approach by using a vertically stacked configuration where the switch component acts as a spatial mediator. By positioning the switch above the light sensing component, the design enables the photoelectric conversion layer to expand horizontally without direct lateral contact between the switch and light sensing areas, thus reducing current leakage paths while maximizing the active sensing area.
3Device complexity
If the switch component is disposed on the substrate adjacent to the light sensing component, then the device complexity is reduced, but the image quality deteriorates
Solution Approach 1:
The patent resolves the conflict between device simplicity and image quality by moving the switch component from a lateral arrangement to a vertical stacking configuration. This dimensional transition maintains the low complexity of the component layout while significantly improving image quality through enhanced fill factor and increased photoelectric conversion efficiency, allowing more photons to be detected per pixel area.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration increases the fill factor by up to 11% and signal-to-noise ratio, improving image quality by increasing the area of the photoelectric conversion layer and the number of photon signals received, while potentially reducing X-ray radiation exposure.
Implementation Method 1
The first photoelectric conversion layer is disposed on the first bottom electrode... for converting optical energy to electrical energy
Implementation Method 2
a scintillator layer... for converting an incident X-ray into a visible light
Data Source
AI summary
An X-ray device including a sensing panel and a scintillator layer is provided. The sensing panel includes a substrate and a first pixel. The first pixel is disposed on the substrate and includes a first light sensing component and a first switch component. The first switch component is disposed on the first light sensing component. The scintillator layer is disposed on the sensing panel, and the first switch component is disposed between the scintillator layer and the first light sensing component.