Stacking Carrier for IC Packaging to Prevent Wafer Warpage
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Solution Overview
Problem
Current integrated circuit packaging technologies face challenges in increasing density without sacrificing reliability, yield, and cost, particularly in portable electronic devices, where miniaturization and cost reduction are critical but not adequately addressed by existing solutions.
Innovation Solution
The method involves using a stacking carrier with a cavity to mount a base integrated circuit and a stack integrated circuit, eliminating temporary bonding processes and reducing assembly costs through pick-and-place techniques, which enhances manufacturing efficiency and reduces the risk of wafer cracks and warpage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If integrated circuits are stacked into a single package to increase density, then the number of integrated circuits per package increases, but the risk of wafer cracks and warpage increases
Solution Approach 1:
The patent introduces a carrier as an intermediary component that supports multiple integrated circuits during the stacking process. The carrier provides mechanical support and stability, preventing direct contact between wafers that would cause cracks and warpage. This mediator enables high-density stacking while maintaining reliability by distributing mechanical stresses across the carrier structure rather than concentrating them on the fragile wafer interfaces.
2Ease of manufacture
If traditional temporary bonding processes are used for stacking, then assembly can be performed, but manufacturing costs increase and process complexity increases
Solution Approach 1:
The patent extracts and eliminates the temporary bonding step from the traditional stacking process. By using a carrier-based approach, the method removes the need for temporary adhesives or bonding processes that would require additional removal steps. The carrier itself serves as the mounting structure, allowing direct placement and permanent attachment without intermediate bonding operations, thereby simplifying the manufacturing process.
3Volume of moving object
If miniaturization is pursued to improve portability, then device size decreases, but manufacturing precision requirements increase
Solution Approach 1:
The patent applies preliminary action by pre-positioning multiple integrated circuits on the carrier in their final stacked configuration before the actual stacking operation. The carrier is designed with predetermined locations and alignment features that guide the placement of each circuit. This pre-arranged structure ensures precise alignment is maintained throughout the stacking process, enabling miniaturization without compromising manufacturing precision.
Data Source
AI summary
A method of manufacture of an integrated circuit packaging system includes: providing a stacking carrier having a cavity; placing a base integrated circuit in the cavity, the base integrated circuit having a base interconnect facing the cavity; mounting a stack integrated circuit to the base integrated circuit; and picking the stack integrated circuit mounted to the base integrated circuit out of the stacking carrier.