Stacking Modular Instrument Bus Device With Customized Connectors
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Solution Overview
Problem
Existing modular instrumentation systems, such as those based on PXI and VXI instrument buses, suffer from limited extensibility and flexibility, requiring re-customization of hardware and software when test objects or models change, leading to inefficiencies and increased costs in equipment testing and maintenance.
Innovation Solution
A stacking modular instrument bus device comprising N instrument sub-modules connected through N+1 customized bus connectors, with separate bus and functional units, allowing for flexible reconfiguration and independent design of functional units while maintaining a common bus unit design, enabling modular instrument systems to be stacked like building blocks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a backboard chassis type hardware structure is adopted, then the instrument system provides a fixed framework for inserting instrument modules, but the extensibility is limited by the card slots and the minimum volume is determined by the chassis size
Solution Approach 1:
The patent divides the instrument system into independent instrument modules that can be separately designed, manufactured, and connected. Each module contains its own processing unit, memory, and interface circuits, allowing the system to be segmented into functional units rather than being constrained by a fixed chassis architecture. This segmentation enables flexible reconfiguration and expansion without being limited by predetermined card slots or chassis dimensions.
Solution Approach 2:
The patent transitions from a two-dimensional card slot insertion model to a three-dimensional modular stacking architecture. Instrument modules are connected through multi-layer PCB traces and vertical interconnects, enabling expansion in multiple spatial dimensions. This dimensional change allows the system to accommodate varying numbers of modules without being constrained by the linear card slot arrangement of traditional backboard chassis designs.
2Quantity of substance
If a backboard chassis with ten card slots is used, then the system can accommodate up to ten instrument modules, but the volume cannot be decreased even when only 2-3 modules are needed
Solution Approach 1:
The system is divided into independently configurable instrument modules that can be selectively combined. Each module is a self-contained unit with standardized interfaces, allowing the system to be assembled with only the necessary number of modules for a given application. This segmentation eliminates the need to allocate space for unused modules, enabling the system volume to be precisely matched to actual requirements rather than being fixed by a chassis designed for maximum capacity.
Solution Approach 2:
The patent implements a dynamic module configuration capability where the number, arrangement, and connectivity of instrument modules can be changed based on specific test requirements. The modular architecture with standardized interfaces allows the system to be reconfigured without physical rework, enabling the volume to be dynamically adjusted to match the actual number of modules needed rather than being statically determined by the chassis design.
3Adaptability or versatility
If test objects or models change, then the test requirements change, but the hardware and software need to be re-customized causing waste and inconvenience
Solution Approach 1:
The patent designs instrument modules with universal standardized interfaces and a common bus architecture that can accommodate different functional units. The standardized interfaces include uniform connection protocols and data formats that work across all module types. This universality allows the same hardware platform to support various test objects and measurement functions by simply changing the functional units, eliminating the need for hardware re-customization and reducing software reconfiguration time.
Solution Approach 2:
The system architecture separates the common infrastructure (bus controller, communication protocols, power management) from the functional units. This segmentation allows functional units to be independently selected and combined to match specific test requirements without affecting the common infrastructure. When test objects change, only the functional units need to be replaced rather than re-customizing the entire hardware and software system, significantly reducing reconfiguration time and costs.
Data Source
AI summary
A stacking modular instrument bus device includes N instrument sub-modules, N+1 customized bus connectors, a first bus termination module and a second bus termination module. The N instrument sub-modules are connected with each other in series through the N−1 customized bus connectors to form an instrument sub-system, two ends of the N instrument sub-modules are respectively connected with the first bus termination module and the second bus termination module through one customized bus connector; each of the instrument sub-modules includes a bus unit and a functional unit. The present invention can freely stack and combine all the instrument sub-modules in the manner of building blocks, which is divorced from the conventional backboard type structure and becomes more flexible. Every instrument sub-module has the independent and complete instrument structure and form the system itself. The bus unit of the instrument sub-module is detached from the functional unit thereof.