Multi-stage Substrate Cooling Plate with Dynamic Thermal Connection
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Solution Overview
Problem
Existing substrate processing apparatuses face challenges in maintaining stable substrate temperatures during film forming processes, leading to inefficiencies and the need for dummy substrates to stabilize the stage temperature, which increases processing time and reduces productivity.
Innovation Solution
A stage structure with multiple stages sharing a common cooling plate and a refrigerator, along with a heater controller, allows for precise temperature control by thermally connecting and separating stages with the cooling plate, and rotating them during non-processing phases, thereby stabilizing the substrate temperature without the need for dummy substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single cooling plate is shared by multiple stages, then the device complexity is reduced, but the temperature control precision for each stage deteriorates
Solution Approach 1:
The cooling plate is divided into multiple independently controllable cooling regions, each capable of adjusting its temperature separately. This allows different stages to have different temperature settings while sharing a common cooling plate structure, thus maintaining both simplicity and precision.
Solution Approach 2:
Different regions of the cooling plate are assigned different cooling powers and temperature settings according to the specific needs of each stage. This local differentiation enables precise temperature control for each stage while keeping the overall structure unified and simple.
2Stability of the object's composition
If the stage is thermally connected to the cooling plate during processing, then the temperature stability is improved, but the rotation capability deteriorates
Solution Approach 1:
The thermal connection between the stage and cooling plate is made dynamic rather than fixed. The stage can be thermally connected to the cooling plate when temperature stability is needed, and thermally separated when rotation is required. This dynamic adjustment allows the system to adapt between different operational modes.
Solution Approach 2:
The thermal connection path is segmented and can be selectively activated or deactivated for each stage independently. This allows the stage to be rotated when thermal connection is interrupted, while maintaining temperature stability when the thermal connection is established, thus resolving the contradiction between these two functions.
3Stability of the object's composition
If dummy substrates are used to stabilize stage temperature, then the temperature stability is improved, but the productivity deteriorates
Solution Approach 1:
The cooling system provides self-service temperature stabilization through its ability to dynamically adjust cooling power and thermal connection without requiring external dummy substrates. The system automatically maintains stable temperatures for actual substrates during processing, eliminating the need for productivity-reducing dummy substrate operations.
Solution Approach 2:
The cooling system changes operational parameters such as cooling power level and thermal connection state to achieve temperature stabilization. By adjusting these parameters dynamically based on real-time temperature feedback, the system stabilizes stage temperature without requiring dummy substrates, thus maintaining high productivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables continuous substrate processing with improved temperature stability and reduced processing time by dynamically adjusting the thermal connection and rotation of stages, enhancing the efficiency of film forming processes.
Implementation Method 1
a refrigerator (51) that cools the cooling plate (52)
Implementation Method 2
an elevating device (7) that thermally connects or separates a first contact surface (4S) of the plurality of stages (4) and a second contact surface (521S) of the cooling plate (52)
Data Source
AI summary
A stage structure includes a plurality of stages respectively configured to support a substrate placed thereon, a single cooling plate common to the plurality of stages, a refrigerator configured to cool the cooling plate, and an elevating device configured to thermally connect or separate a first contact surface of the plurality of stages and a second contact surface of the cooling plate.