Multi-Plate Semiconductor Stage With Insulating Damper
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Solution Overview
Problem
Existing semiconductor stages using ceramics face limitations in achieving a temperature difference between the inner and outer regions greater than 10°C, leading to potential damage due to thermal stress.
Innovation Solution
A stage design incorporating metal plates with grooves, through holes, and heat insulating portions, along with independent circulating flow paths and heaters, allows for a large temperature gradient between inner and outer regions by controlling heat conduction and distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a temperature difference greater than 10°C is achieved between inner and outer regions of a ceramic stage, then the temperature gradient profile is improved, but the stage may be damaged due to thermal stress
Solution Approach 1:
The stage is divided into multiple independent metal plates (first metal plate, second metal plate, third metal plate) with through holes and grooves, allowing each plate to expand and contract independently in response to temperature changes, thereby reducing thermal stress while maintaining the temperature gradient
Solution Approach 2:
The invention transitions from using a single ceramic material to a composite structure of multiple metal plates with heat insulating portions, combining the thermal conductivity benefits of metal with the thermal insulation needed to maintain temperature gradients without excessive stress
2Manufacturing precision
If a temperature difference of at least 20°C is achieved between inner and outer regions, then uniform temperature distribution on wafers is improved, but thermal stress increases
Solution Approach 1:
Different regions of the stage are given different thermal properties through the heat insulating portions positioned between inner and outer regions, allowing the inner region to be heated to higher temperatures while the outer region remains cooler, creating the desired temperature gradient without uniform stress distribution
Solution Approach 2:
Heat insulating portions are introduced as intermediary elements between the inner and outer regions of the stage, mediating the thermal transfer and allowing the system to maintain large temperature differences while reducing the direct thermal stress that would occur in a monolithic structure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The stage achieves a temperature difference of at least 20°C between the inner and outer regions, effectively correcting temperature drops and ensuring uniform temperature distribution on wafers, while mitigating thermal stress through a heat insulating damper effect.
Implementation Method 1
a heat insulating portion in which the first groove, the through hole, and the second groove are connected to one another
Implementation Method 2
a first circulating flow path and a first heater provided in one of the first metal plate, the second metal plate, and the third metal plate
Implementation Method 3
The first circulating flow path and the second circulating flow path are provided in a first region defined by the heat insulating portion as a boundary
Data Source
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AI summary
A stage includes a first metal plate including a first groove, a second metal plate including a through hole below the first metal plate, a third metal plate including a second groove below the second metal plate, a heat insulating portion in which the first groove, the through hole, and the second groove are connected to one another, a first circulating flow path and a first heater provided in one of the first metal plate, the second metal plate, and the third metal plate, and one of a second circulating flow path and a second heater. The first circulating flow path and the second circulating flow path are provided in a first region defined by the heat insulating portion as a boundary. The first heater and the second heater are provided in a second region opposite the first region defined by the heat insulating portion as the boundary.