Stage Insulating Film Layout for Higher Withstand Voltage
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Solution Overview
Problem
Conventional thermal spraying methods for forming insulating films on stages result in gaps or voids at the interface between surfaces, leading to reduced withstand voltage, which is a challenge as higher voltages are required for modern semiconductor device manufacturing.
Innovation Solution
A stage design with a base material having insulating films formed on multiple surfaces, where the insulating film is applied from perpendicular directions to the surfaces in parallel movements, and the application is alternated or continuous to ensure uniform coverage, minimizing gaps and voids.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If thermal spraying method is used to form insulating film on stage surfaces, then the insulating film can be formed, but gaps or voids occur at the interface between surfaces resulting in decreased withstand voltage
Solution Approach 1:
The insulating film formation process is segmented into multiple sequential spraying operations. The first insulating film is formed by spraying from a first direction, then a second insulating film is formed by spraying from a second direction that intersects with the first direction. This segmentation allows each spraying operation to address specific surface areas, and the combination of multiple directions ensures complete coverage without gaps at interfaces.
Solution Approach 2:
The patent transitions from single-direction spraying to multi-directional spraying. By introducing a second spraying direction that intersects with the first direction (at angles between 30° and 150°), the process adds dimensional complexity to ensure comprehensive coverage. This dimensional change eliminates the gap formation problem that occurs with single-direction spraying at surface interfaces.
2Power
If higher voltage is applied to stage for miniaturized semiconductor devices, then processing capability is improved, but withstand voltage requirements of stage members increase
Solution Approach 1:
The patent creates a composite insulating film structure by forming multiple layers of insulating material from different spraying directions. The first insulating film and second insulating film together form a composite structure that provides enhanced dielectric properties. This composite approach allows the stage to withstand higher voltages required for processing miniaturized semiconductor devices while maintaining reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method enhances the dielectric breakdown voltage by ensuring a dense, uniform insulating film coverage, thereby improving the stage's withstand voltage.
Implementation Method 1
spraying an insulator onto a first surface from a perpendicular direction to the first surface while moving in a parallel direction to the first surface of the base material
Implementation Method 2
an insulating film consisting of a plurality of particles each having a flat surface. A part of the flat surface included in the insulating film is provided along the first surface and the second surface
Data Source
AI summary
A stage includes a base material having a first surface and a second surface adjacent to the first surface, and an insulating film including a plurality of particles, each of the plurality of particles having a flat surface. The flat surface included in the insulating film is provided along the first surface and the second surface. The base material includes a third surface in a direction 180 degrees opposite to the first surface, and a part of the flat surface included in the insulating film is provided along the third surface, and a surface obtained by extending the first surface and a surface obtained by extending the second surface intersect at 90 degrees. The base material includes a third surface in a direction 180 degrees opposite to the first surface, and a part of the flat surface included in the insulating film is provided along the third surface.