Stage Apparatus with Ring Protrusion for Warped Substrate Positioning

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Solution Overview

Problem

The increasing use of non-flat, warped, or bended substrates in semiconductor manufacturing poses challenges for accurate clamping and positioning in lithographic apparatuses, as conventional clamping methods struggle to handle out-of-plane shapes effectively, leading to misalignment and potential errors in the lithographic process.

Innovation Solution

A stage apparatus with a ring-shaped protrusion and a sensor module that detects the object support and object, allowing for the determination of an offset value representing the object's position relative to the protrusion, enabling precise adjustment and improved mounting accuracy through a processing unit and object handler systems.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If conventional clamping methods are used for non-flat substrates, then the manufacturing process can proceed with standard equipment, but the positioning accuracy and mounting precision deteriorate due to out-of-plane warping

Engineering Contradiction:

Improveadaptability to non-flat substratesVSAvoidmounting precision

Core Design Contradiction:

Adaptability or versatilityVSManufacturing precision

Solution Approach 1:

The system performs preliminary detection of the substrate position and shape using a sensor module before mounting. The processing unit calculates offset values based on detected positions of the ring-shaped protrusion and substrate, enabling pre-compensation for warping effects before the actual clamping operation occurs

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The sensor module provides real-time feedback on the substrate position and the ring-shaped protrusion location. The processing unit uses this feedback to calculate offset values that are fed back to the object handler, creating a closed-loop control system that continuously corrects for positioning errors due to substrate warping

Inventive Principle:

Principle #23Feedback

2Extent of automation

If a robot is used for substrate mounting, then the automation level increases, but the positioning accuracy deteriorates when handling warped substrates due to inability to compensate for out-of-plane deviations

Engineering Contradiction:

Improveautomation levelVSAvoidpositioning accuracy

Core Design Contradiction:

Extent of automationVSMeasurement precision

Solution Approach 1:

The system replaces purely mechanical positioning with a hybrid system that uses optical sensors to detect substrate position and ring-shaped protrusion location. The processing unit substitutes mechanical calculation with computational algorithms that determine offset values based on detected positions, enabling the automated robot to compensate for warping that would otherwise require complex mechanical adjustments

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The system dynamically changes the positioning parameters by calculating offset values that represent the deviation between the substrate center and the ring-shaped protrusion center. These offset parameters are used to adjust the robot's positioning commands, allowing the automated system to adapt to varying substrate warping conditions

Inventive Principle:

Principle #35Parameter changes

3Device complexity

If no offset determination is performed, then the system complexity remains low, but the mounting accuracy deteriorates for substrates with out-of-plane shapes

Engineering Contradiction:

Improvesystem complexityVSAvoidmounting accuracy

Core Design Contradiction:

Device complexityVSManufacturing precision

Solution Approach 1:

The processing unit acts as an intermediary that receives raw position data from the sensor module, calculates offset values representing the deviation between substrate center and ring-shaped protrusion center, and provides corrected positioning information to the object handler. This intermediary computational step adds minimal complexity but significantly improves mounting accuracy for warped substrates

Inventive Principle:

Principle #24Intermediary (Mediator)

Data Source

PatentUS11556064B2Stage apparatus and method for calibrating an object loading process

Publication Date: 2023.01.17 ASML NETHERLANDS BV

AI summary

The invention provides a stage apparatus, comprising an object support comprising a ring shaped protrusion having an outer radius in a first plane, and configured to support an object with a radius in the first plane larger than the outer radius of the ring shaped protrusion. The stage apparatus further comprises a sensor module configured to detect the object support, and the object when it is arranged on the object support. The stage apparatus further comprises a processing unit configured to receive one or more signals from the sensor module, and to determine, based on said one or more signals, a position of the object relative to the ring shaped protrusion when the object is arranged on the object support. The processing unit is further configured to determine, based on said position of the object, an offset value representing the position of the object relative to the ring shaped protrusion.