Staged Through-Substrate Via Structure to Prevent Plating Voids
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Solution Overview
Problem
Existing substrate structures face challenges in forming vias with complete structures and good electrical properties due to issues such as voids or collapse during the electroplating process, particularly in straight vias.
Innovation Solution
The substrate structure is formed by filling a release material into a through hole to create a temporary carrier, allowing the via to be constructed in stages, with the release material being removed after forming the lower and upper portions to avoid voids or collapse.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conductive material is plated into the through hole from both sides simultaneously, then the via formation process is simplified, but voids or collapse occur in the via structure
Solution Approach 1:
The via formation process is divided into two sequential stages: first forming the lower conductive component from the first side, then forming the upper conductive component from the second side. This segmentation eliminates the voids and collapse issues that occur with simultaneous two-side plating, while still maintaining efficient via formation through the staged approach.
Solution Approach 2:
The lower conductive component is formed in advance before forming the upper conductive component. This preliminary action provides a stable foundation and proper spacing that prevents collapse and void formation when the upper component is subsequently formed, ensuring complete via structure.
2Reliability
If the via is formed as a single continuous structure, then the electrical connection is simplified, but voids and collapse occur particularly in straight vias
Solution Approach 1:
The via is segmented into a lower conductive component and an upper conductive component formed at different stages. The lower component provides structural support and proper spacing, preventing collapse and voids, while the upper component completes the electrical connection. The release material ensures electrical continuity between the two segments.
Solution Approach 2:
The release material acts as an intermediary that maintains proper spacing between the lower and upper conductive components during formation, preventing collapse and voids. After formation, the release material is removed, and the via components are reconnected to establish complete electrical continuity.
3Manufacturing precision
If release material is used as a temporary carrier for staged via formation, then voids and collapse are eliminated, but the process complexity increases
Solution Approach 1:
The release material serves as a temporary intermediary carrier that simplifies the staged via formation process. It maintains proper spacing and positioning of conductive components during formation, preventing collapse and voids. The release material is easily removed after formation, and the via components are reconnected, making the additional process steps manageable while achieving complete via structure.
Solution Approach 2:
The release material is a temporary, disposable component used only during the via formation process. It performs its spacing and positioning function, then is removed after serving its purpose. This approach adds minimal permanent complexity to the final structure while enabling precise staged via formation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method ensures the formation of vias with continuous sidewalls and improved electrical connections, eliminating issues of voids and collapse, resulting in enhanced electrical properties.
Implementation Method 1
a via may be formed by disposing a seed layer and electroplating conductive material in the through hole
Data Source
AI summary
A substrate structure is provided. The substrate structure includes a substrate and a via. The substrate has a first side and a second side opposite to each other. The via is disposed in the substrate and penetrates the substrate along a first direction, wherein the via includes a first conductive component and a second conductive component. The first conductive component is adjacent to the first side of the substrate, wherein the first conductive component includes a first seed layer and a first conductive part. The second conductive component is adjacent to the second side of the substrate and electrically connected to the first conductive component, wherein a first contact interface is formed between the second conductive component and the first seed layer. The first contact interface extends along a second direction, and the second direction is different from the first direction.