Staggered BGA Package for Touch Panel Controller
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Solution Overview
Problem
As touch panel sizes increase, the number of sensors and corresponding pins/balls for signal processing grows, leading to larger package sizes for touch panel controllers, which in turn increases manufacturing costs.
Innovation Solution
A compact ball grid array (BGA) package with a staggered pattern of solder bumps on a package substrate, coupled to electrodes via a multi-layer circuit board, reduces the package size while supporting an increased number of electrodes, achieved by optimizing the arrangement of solder bumps in a staggered pattern with specific row and column configurations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the number of sensors and pins/balls is increased to support larger touch panels, then the signal processing capability is improved, but the package size increases leading to higher manufacturing costs
Solution Approach 1:
The patent transitions from a traditional grid arrangement to a staggered hexagonal pattern, effectively utilizing spatial dimensions more efficiently. This dimensional optimization allows more solder bumps to be packed into a smaller area by arranging them in offset rows rather than aligned grids, resolving the contradiction between increasing sensor quantity and maintaining compact package size
Solution Approach 2:
The patent changes the arrangement parameters of solder bumps from conventional rectangular grid to staggered hexagonal pattern with specific pitch relationships. By modifying the geometric parameters (pitch ratios, row offsets) and arrangement topology, the package density is optimized to accommodate more connections without proportionally increasing package area
2Quantity of substance
If the package size is increased to accommodate more pins/balls, then the number of sensors that can be supported is improved, but the manufacturing cost increases
Solution Approach 1:
By adopting a staggered hexagonal arrangement instead of conventional rectangular grid, the patent achieves higher connection density within the same package footprint. This dimensional reorganization allows supporting more sensors without increasing package size, thereby avoiding the cost escalation associated with larger packages
Solution Approach 2:
The patent optimizes manufacturing parameters including solder bump pitch ratios (horizontal pitch to vertical pitch), row offsets, and hollow region dimensions. These parameter optimizations enable more efficient use of package real estate, allowing higher sensor counts to be supported within standard package size ranges, thus controlling manufacturing costs
Data Source
AI summary
A ball grid array (BGA) package for use in a touch panel controller includes a package substrate and a plurality of solder bumps. The plurality of solder bumps are disposed on the package substrate, arranged in a staggered pattern surrounding a hollow region on the package substrate, and coupled to electrodes of a touch panel via a multi-layer circuit board. The staggered pattern includes Ys1 top rows and Ys2 bottom rows, a minimum vertical distance between centers of two vertically adjacent solder bumps in the Ys1 top rows and the Ys2 bottom rows being referred to as an equivalent vertical pitch, and Ys1, Ys2 being integers exceeding 2. the hollow region has a minimum length defined by the minimum length=((Ys1−2)+(Ys2−2))*the equivalent vertical pitch.