Staggered Bipolar Plate Cooling Channels for Lower Pressure Drop

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Solution Overview

Problem

Existing bipolar plates in electrochemical reactors experience significant pressure losses in the cooling circuit due to turbulent flow and narrow conduits, which affects the efficiency of both heat transfer and reactive fluid distribution.

Innovation Solution

A bipolar plate design featuring anode and cathode sheets with staggered bosses and depressions, allowing for a cooling circuit with minimal constriction and reduced pressure loss, where the channels and ribs on each sheet are offset to facilitate smooth heat transfer fluid flow without compromising reactive fluid circulation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If bosses are arranged in aligned channels in bipolar plates, then the structure is simple to manufacture, but the heat transfer fluid experiences significant pressure drop and turbulent flow

Engineering Contradiction:
Improvemanufacturing simplicityVSAvoidpressure drop in cooling circuit
Core Design Contradiction:
Ease of manufactureVSLoss of energy

Solution Approach 1:

The patent applies asymmetry by staggering the bosses in the anodic plate relative to the bosses in the cathodic plate, rather than aligning them in straight channels. This asymmetric arrangement creates offset cooling conduits that allow smoother fluid flow and reduce turbulence and pressure drop while maintaining manufacturing simplicity through standard stamping processes

Inventive Principle:
Principle #4Asymmetry

2Length of moving object

If cooling conduits are made narrow to reduce plate thickness, then the device size is reduced, but the pressure drop in the cooling circuit increases significantly

Engineering Contradiction:
Improveplate thicknessVSAvoidpressure drop in cooling circuit
Core Design Contradiction:
Length of moving objectVSLoss of energy

Solution Approach 1:

The patent resolves this contradiction by transitioning from a single-plane channel arrangement to a three-dimensional offset arrangement. The staggered bosses create cooling conduits that extend through the plate thickness in an offset pattern, allowing the conduits to maintain adequate cross-sectional area for low pressure drop while the overall plate thickness remains reduced. This dimensional reorganization allows smooth fluid flow paths that avoid excessive narrowing

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design reduces pressure losses in the cooling circuit by approximately 40% compared to prior art, ensuring efficient heat transfer without narrowing the reactive fluid channels, thus maintaining the overall efficiency of the electrochemical reactor.

Implementation Method 1

cooling conduits for the flow of a heat transfer fluid

Methodology Applied
Scientific EffectHeat transfer: Conduction (thermal)

Implementation Method 2

circulation of reactive fluids... flow of a heat transfer fluid

Methodology Applied
Scientific EffectConvection: Convection

Data Source

PatentEP4007019B1Bipolar plate for electrochemical reactor
Publication Date: 2023.10.04 COMMISSARIAT A LENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
  • EP4007019B1 patent drawingFigure 1a
  • EP4007019B1 patent drawingFigure 1b
  • EP4007019B1 patent drawingFigure 1c

AI summary

Bipolar plate for an electrochemical reactor, comprising at least one anodic plate (Ta) and one cathodic plate (Tc), each having an inner face (102) and an outer face (101), the anodic (Ta) and cathodic (Tc) plates being in contact with each other via their inner face (102), each anodic (Ta) and cathodic (Tc) plate having on its outer face (101) channels (Cc1, Cc2, Cc3, Cc4, Ca1, Ca2, Ca3, Ca4) for the circulation of reactive fluids, said channels delimiting, at the level of the inner faces of the anodic and cathodic plates, cooling conduits (20) for the flow of a heat transfer fluid, the channels of the anodic and cathodic plates having an alternation of bosses (Ba, Bc) and indentations (Ea, Ec), the bosses of the anodic plate (Ba) being arranged in staggered and the bosses of the cathode ray sheet (Bc) being arranged in a staggered pattern.