Staggered Bit-Line Memory Subsystem for Reduced Pitch Reliability

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Existing memory devices face challenges in reducing the pitch between bit-lines due to limitations in circuit-protection device size, which increases the overall device size and affects data integrity and reliability.

Innovation Solution

The implementation of an offset stagger pattern for bit-line contacts and circuit-protection devices, allowing for a reduced pitch without compromising bit-line to bit-line leakage or breakdown voltage, by offsetting bit-line contacts in a zig-zag configuration.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of stationary object

If the pitch between bit-lines is reduced to increase memory density, then the area of the memory device is reduced, but the circuit-protection device size becomes too large relative to the pitch, compromising data integrity and reliability

Engineering Contradiction:
Improvememory device areaVSAvoiddata integrity
Core Design Contradiction:
Area of stationary objectVSReliability

Solution Approach 1:

The patent offsets bit-line contacts in the first bit-line connection line relative to bit-line contacts in the second bit-line connection line, effectively utilizing the lateral dimension to create spacing. This offset stagger pattern allows the circuit-protection devices to be positioned such that they maintain adequate effective distance from bit-lines while the overall pitch between bit-line connection lines is reduced, thereby reducing memory device area without compromising data integrity

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent introduces asymmetry in the layout by offsetting bit-line contacts in alternating rows by a predetermined distance. This asymmetric staggered arrangement allows circuit-protection devices to be positioned optimally relative to bit-lines, maintaining sufficient spacing for reliability while enabling tighter overall pitch between bit-line connection lines, thus resolving the contradiction between area reduction and reliability maintenance

Inventive Principle:
Principle #4Asymmetry

2Productivity

If the pitch between bit-lines is reduced to increase memory density, then productivity is improved, but bit-line to bit-line leakage increases

Engineering Contradiction:
Improvememory device densityVSAvoidbit-line leakage
Core Design Contradiction:
ProductivityVSObject-generated harmful factors

Solution Approach 1:

By offsetting bit-line contacts in alternating rows laterally, the patent creates additional effective distance between adjacent bit-lines in the vertical direction. This dimensional rearrangement allows reduced pitch between bit-line connection lines (increasing density) while maintaining sufficient lateral spacing to prevent bit-line to bit-line leakage through the circuit-protection devices

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The circuit-protection devices serve as intermediary elements between adjacent bit-lines. The offset stagger pattern positions these intermediary devices to effectively block leakage paths between bit-lines while allowing the bit-line connection lines to be closer together, thus enabling higher density without increasing leakage

Inventive Principle:
Principle #24Intermediary (Mediator)

3Area of stationary object

If the pitch between bit-lines is reduced to increase memory density, then the area is reduced, but the circuit-protection subsystem size becomes too large

Engineering Contradiction:
Improvememory device areaVSAvoidcircuit-protection subsystem size
Core Design Contradiction:
Area of stationary objectVSDevice complexity

Solution Approach 1:

The offset stagger pattern utilizes lateral offsetting of bit-line contacts to create effective spacing, which allows the circuit-protection subsystem to be more compact in the vertical direction. By arranging circuit-protection devices to leverage the lateral offset, the overall subsystem size is reduced while maintaining adequate protection functionality, enabling higher memory device density

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS20260018512A1Reduced pitch memory subsystem for memory device
Publication Date: 2026.01.15 MICRON TECHNOLOGY INC
  • US20260018512A1 patent drawing
  • US20260018512A1 patent drawing
  • US20260018512A1 patent drawing

AI summary

A memory device includes an array of memory cells and a plurality of bit-lines with each bit-line connected to a respective set of memory cells of the array of memory cells. The memory device includes a memory subsystem having first and second memory circuits. Each first memory circuit can be disposed laterally adjacent to a second memory circuit. Each first memory circuit includes a first bit-line connection and each second memory circuit including a second bit-line connection, the first and second bit-line connections can connect to respective bit-lines. Each first bit-line connection is disposed on a first bit-line connection line of the memory subsystem and each second bit-line connection is disposed on a second bit-line connection line of the memory subsystem, and the second bit-line connection line can be offset from the first bit-line connection line by a predetermined distance that is greater than zero.