Staggered Bond Fingers for Semiconductor Package Integration
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Solution Overview
Problem
Current semiconductor packages face challenges in efficiently arranging multiple circuit patterns within a limited area, particularly in achieving a denser integration of bond finger arrays to optimize space usage and prevent electrical short circuits during wire bonding.
Innovation Solution
The semiconductor package incorporates staggered bond finger arrays on a package substrate, with overlapping bond fingers arranged in a specific pattern to enhance integration density and prevent electrical short circuits, allowing for efficient wire bonding and improved design flexibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If bond finger arrays are arranged in a conventional non-overlapping pattern, then electrical short circuits are prevented, but integration density and space usage are reduced
Solution Approach 1:
The patent transitions from a one-dimensional linear arrangement of bond fingers to a two-dimensional staggered grid pattern. Bond fingers are arranged in multiple rows and columns with offset positioning, allowing vertical and horizontal overlap patterns that increase the number of bond fingers per unit area while maintaining electrical isolation through precise spatial separation.
Solution Approach 2:
The staggered arrangement creates a nested pattern where bond fingers from different arrays interleave with each other in a coordinated manner. The first and second bond finger arrays are positioned such that their fingers alternate in the vertical direction, creating a compact nested structure that maximizes space utilization without causing electrical interference.
2Quantity of substance
If bond finger arrays are arranged to maximize integration density, then space usage is optimized, but risk of electrical short circuits during wire bonding increases
Solution Approach 1:
The patent employs asymmetric positioning of bond fingers within the staggered grid, where the horizontal and vertical spacing patterns are deliberately non-uniform. This asymmetric arrangement creates irregular spacing that prevents regular wire bonding paths from accidentally bridging adjacent bond fingers, thereby reducing short circuit risk while maintaining high density.
Solution Approach 2:
Different regions of the bond finger array have locally optimized spacing characteristics. Areas with higher wire bonding activity have greater vertical separation, while regions with lower activity can have tighter spacing. The staggered pattern allows local adjustment of finger positions to match the specific wire bonding requirements of different chip pad locations.
3Ease of manufacture
If conventional bond finger arrangements are used, then manufacturing processes are simple, but design flexibility and integration options are limited
Solution Approach 1:
The bond finger array is segmented into multiple independent first and second arrays that can be independently configured and optimized. Each array can be designed with specific spacing and positioning characteristics suited to different chip types and wire bonding patterns, allowing flexible adaptation to various package designs while maintaining a systematic manufacturing approach.
Data Source
AI summary
A semiconductor package includes a package substrate including: first and second bond finger arrays, each of the first and second finger arrays arranged in a first direction on a surface of the package substrate; a first semiconductor chip disposed on the surface of the package substrate and including a first chip pad array corresponding to the first bond finger array; a second semiconductor chip disposed on the surface of the package substrate and including a second chip pad array corresponding to the second bond finger array; first bonding wires connecting bond fingers of the first bond finger array to chip pads of the first chip pad array; and second bonding wires connecting bond fingers of the second bond finger array to chip pads of the second chip pad array.