Staggered Bond Pad Arrangement for IC Chip Area Reduction
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Solution Overview
Problem
The conventional arrangement of bond pads on IC chips, with two rows aligned vertically, occupies a large area of the chip surface, reducing the yield of IC chips from wafers due to restrictive spacing requirements.
Innovation Solution
The bond pads are arranged alternately across two rows, with short sides parallel to the chip's long sides, reducing the overall area occupied by the pads and allowing for increased spacing, thereby enhancing wafer yield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If bond pads are arranged in two vertically aligned rows, then the bonding functionality is achieved, but the area occupied by bond pads increases, reducing wafer yield
Solution Approach 1:
The bond pads in the first and second rows are arranged asymmetrically relative to each other, rather than being vertically aligned. This asymmetric arrangement reduces the overall area occupied by bond pads while maintaining bonding functionality, thereby improving wafer yield.
Solution Approach 2:
Instead of arranging bond pads in simple vertical alignment (one-dimensional arrangement), the invention utilizes a two-dimensional staggered arrangement where bond pads in adjacent rows are offset from each other. This dimensional change allows for more efficient space utilization and reduces the total area occupied.
2Device complexity
If bond pads are arranged in vertically aligned rows, then the layout is simple, but the spacing requirements reduce the number of chips per wafer
Solution Approach 1:
The asymmetric staggered arrangement of bond pads between rows provides a simple yet effective solution that maintains ease of layout while significantly improving wafer yield through optimized space utilization.
3Area of stationary object
If bond pads are arranged alternately in staggered rows, then the area occupied is reduced, but the arrangement complexity increases
Solution Approach 1:
The bond pad arrangement is segmented into distinct rows with alternating staggered positions. This segmentation creates a systematic pattern that reduces area while keeping the arrangement manageable and not overly complex.
Solution Approach 2:
The asymmetric staggered arrangement efficiently reduces the area occupied by bond pads while maintaining a relatively simple and systematic layout pattern that is easy to implement and manage.
Data Source
AI summary
The embodiments of the present invention discloses an arrangement of bond pads on an integrated circuit chip. The integrated circuit chip includes: a first row of bond pads; and a second row of bond pads, wherein bond pads in the first row are positioned alternately with bond pads in the second row, and a short side of the bond pads in the first row and the second row is parallel to a long side of the integrated circuit chip. With this arrangement of bond pads on the integrated circuit chip, the bond pads may occupy a reduced area of a surface of the integrated circuit chip.