Staggered Display Terminals for IC Driver Mounting

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Solution Overview

Problem

As display devices miniaturize and screen definition increases, the pitch between wires decreases, making it challenging to secure sufficient area for terminal connections and contact holes, leading to potential short-circuiting issues due to reduced margins for inaccuracy in IC driver mounting.

Innovation Solution

The display device employs staggered terminal arrangements with wide and narrow portions for terminal wires and bumps, using anisotropic conductive films to connect IC drivers, and a two-layer structure for terminal wires to ensure reliable contact and prevent short-circuiting, even at smaller pitches.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If the pitch between wires is decreased to enable miniaturization and higher screen definition, then the area for terminal connections and contact holes becomes insufficient, but reducing the pitch further makes it difficult to secure sufficient connection area and increases short-circuiting risk

Engineering Contradiction:
Improvepitch between wiresVSAvoidconnection reliability
Core Design Contradiction:
Manufacturing precisionVSReliability

Solution Approach 1:

The patent transitions from a single-layer terminal arrangement to a multi-layer stacked structure. Terminals are arranged in multiple layers (first layer, second layer, third layer) with alternating wide and narrow portions, effectively utilizing the vertical dimension to increase connection density without compromising horizontal spacing. This allows maintaining adequate connection areas while achieving smaller overall pitch.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The terminal structure is segmented into multiple distinct layers with different functions. The first layer terminals have wide portions for robust connections, while the second layer terminals have narrow portions that fit in the gaps. This segmentation allows each layer to be optimized for its specific function, ensuring reliable connections at reduced pitch.

Inventive Principle:
Principle #1Segmentation

2Area of stationary object

If staggered terminal arrangements are implemented to secure connection area, then the structure complexity increases, but the manufacturing process becomes more complex

Engineering Contradiction:
Improvearea for terminal connectionsVSAvoidterminal structure complexity
Core Design Contradiction:
Area of stationary objectVSDevice complexity

Solution Approach 1:

The patent employs asymmetric terminal designs where terminals in different layers have different widths (wide portions vs. narrow portions). This asymmetry is strategically designed to interlock adjacent terminals, creating a staggered arrangement that maximizes connection area while following a systematic pattern that manages structural complexity.

Inventive Principle:
Principle #4Asymmetry

3Volume of moving object

If the pitch between IC driver bumps is decreased to miniaturize the IC driver, then the connection area with terminals is reduced, but smaller bump pitch reduces the margin for mounting inaccuracy

Engineering Contradiction:
ImproveIC driver sizeVSAvoidmounting accuracy margin
Core Design Contradiction:
Volume of moving objectVSManufacturing precision

Solution Approach 1:

By stacking terminals in multiple layers vertically, the patent compensates for the reduced horizontal connection area caused by smaller bump pitch. The vertical stacking provides additional connection interfaces, ensuring sufficient total connection area even when horizontal spacing is minimized for compact IC drivers.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration secures the necessary area for terminal connections and contact holes, enabling reliable patterning of wires and increasing the margin for inaccuracy in IC driver mounting, thus preventing short-circuiting and ensuring stable operation at smaller pitches.

Implementation Method 1

IC drivers having bumps respectively facing and connected to the terminal wires via an anisotropic conductive film

Methodology Applied
Scientific EffectElectrical conduction: Conduction (electrical)

Data Source

PatentUS9097920B2Display device
Publication Date: 2015.08.04 PANASONIC INTELLECTUAL PROPERTY CORP OF AMERICA
  • US9097920B2 patent drawing
  • US9097920B2 patent drawing
  • US9097920B2 patent drawing

AI summary

A display device includes a substrate having a display region with signal lines within the display region connected to respective terminals in a terminal group outside the display region via terminal wires, and an IC driver having bumps facing and connected to the terminals via an isotropic conductive film. The terminal wires have first, second, third and fourth terminal wires, and the terminals have a first terminal connected to the first terminal wire, a second terminal connected to the second terminal wire, a third terminal connected to the third terminal wire, and a fourth terminal connected to the fourth terminal wire. The first terminal and the second terminal are staggered with respect to each other, the second terminal and the third terminal are staggered with respect to each other, and the third terminal and the fourth terminal are staggered with respect to each other.