Staggered Filter Power Supply Heat Dissipation
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Solution Overview
Problem
Conventional power supplies face challenges with heat dissipation due to limited internal space in standard casings, leading to poor cooling of power transistors and potential overheating, especially in high-power industrial applications where electronic components obstruct airflow.
Innovation Solution
The design integrates power modules with staggered first and second filter circuit boards and cooling fans, creating a better heat flow path by allowing unobstructed airflow through the casing, ensuring effective heat dissipation by utilizing the upper and lower spaces within the standard 19-inch rack format.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If electronic components are arranged in a standard casing, then the power supply can be mounted in a rack, but the internal space is limited and components block airflow causing poor heat dissipation
Solution Approach 1:
The patent transitions from a traditional horizontal arrangement to a vertical three-dimensional layout. Power modules are stacked vertically with filters arranged in alternating layers, creating multiple levels of heat dissipation pathways. This vertical dimensionality allows airflow to move through multiple tiers of components simultaneously, dramatically improving heat dissipation within the same rack-mounted casing volume.
Solution Approach 2:
The power supply is divided into multiple independent power modules, each with its own cooling fan and filter circuit board. This segmentation allows each module to be cooled independently, preventing heat accumulation and enabling optimized airflow paths through each segment. The modular structure also facilitates better spatial arrangement for heat dissipation.
2Power
If more electronic components are added to increase power capacity, then power output increases, but heat generation increases and heat dissipation becomes more difficult
Solution Approach 1:
Heat-generating power modules are extracted and separated into distinct vertical units, each with dedicated cooling resources. The filters are extracted and placed in alternating layers between power modules, creating separate functional zones. This extraction allows heat management to be addressed independently for each power module, preventing cumulative heat effects even as total power capacity increases.
Solution Approach 2:
Filter circuit boards serve as intermediary elements positioned between power modules. These intermediaries not only perform electrical filtering functions but also act as thermal barriers and airflow channels, facilitating heat dissipation from power modules while maintaining electrical isolation and signal integrity.
3Temperature
If a larger casing is used to improve heat dissipation, then cooling efficiency improves, but the power density decreases and space utilization is reduced
Solution Approach 1:
Multiple functional elements are nested within each other in a compact vertical arrangement. Power modules, filters, and cooling fans are nested in alternating layers, with each component utilizing the space created by others. This nested configuration maximizes the use of vertical space within the standard casing, achieving high power density without compromising cooling efficiency.
Solution Approach 2:
The patent employs dynamic airflow management with cooling fans positioned to create optimized air circulation patterns through the vertical stack. The airflow paths are dynamically routed through alternating layers of power modules and filters, adapting to the thermal loads of different components and maintaining efficient heat dissipation at various power levels.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances cooling efficiency within the same casing size, preventing overheating and enabling reliable operation of high-power modules up to 15 KW with universal power input of 180-460V, even in compact 3 U height configurations.
Implementation Method 1
A front side of each of the power modules is provided with a cooling fan... provide a good heat flow path so that the cooling fans can perform heat dissipation effectively for the power modules
Data Source
AI summary
A high power density power supply includes a plurality of cooling fans in a casing. Two sides of the cooling fans are provided with a first filter circuit board and a plurality of power modules, respectively. The first filter circuit board includes a first filter thereon. A plurality of second filter circuit boards are provided on top of the cooling fans, respectively.A second filter is disposed beneath each of the second filter circuit boards. The first filter, the second filter and the power modules are staggered each other, which takes advantage of the upper and lower spaces of the power supply to provide a good heat flow path so that the cooling fans can perform heat dissipation effectively for the power modules. The high power density power supply can achieve a better cooling effect in the casing of the same size.