Staggered Gate Layouts for Tighter Standard Cell Boundaries

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Solution Overview

Problem

As semiconductor devices approach atomic level scaling, the increasing number of devices on integrated circuit chips requires more complex wiring and routing, leading to challenges in reducing cell boundary spacing and optimizing device placement, which existing technologies have not adequately addressed.

Innovation Solution

The technique involves forming semiconductor structures with staggered gate and source/drain regions at cell boundaries, allowing for reduced cell boundary spacing and improved device placement proximity by patterning and connecting gate electrodes and source/drain regions in a specific arrangement, enabling more efficient use of chip area.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Length of moving object

If conventional aligned gate regions are used at cell boundaries, then wiring and routing is simpler, but cell boundary spacing is larger and device placement freedom is reduced

Engineering Contradiction:
Improvecell boundary spacingVSAvoidwiring and routing complexity
Core Design Contradiction:
Length of moving objectVSDevice complexity

Solution Approach 1:

The patent applies asymmetry by staggering gate regions in adjacent circuit rows so that they are offset from each other at cell boundaries rather than being aligned. This asymmetric arrangement reduces cell boundary spacing requirements while the patent manages the increased wiring complexity through specific routing techniques for gate electrodes and interconnect structures.

Inventive Principle:
Principle #4Asymmetry

Solution Approach 2:

The patent utilizes dimensional changes by arranging gate regions in different spatial positions across multiple circuit rows. The staggered configuration shifts gate regions from a one-dimensional aligned pattern to a two-dimensional staggered pattern, enabling reduced cell boundary spacing while accommodating wiring requirements through spatial redistribution.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Productivity

If more devices are packed on the chip, then chip functionality increases, but wiring and routing complexity increases

Engineering Contradiction:
Improvedevice densityVSAvoidwiring and routing complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The patent merges adjacent gate regions from different circuit rows into shared gate structures. By combining gate electrodes that serve multiple circuit cells across row boundaries, the patent increases device density while reducing the total number of separate wiring connections required, thereby managing routing complexity.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The staggered gate configuration enables gate structures to serve multiple functions - controlling transistors in one row while also serving as interconnect elements for adjacent rows. This multi-functionality increases effective device density without proportionally increasing wiring complexity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Data Source

PatentUS20240421145A1Circuit layouts with staggered gate and source/drain regions
Publication Date: 2024.12.19 INTERNATIONAL BUSINESS MACHINE CORPORATION
  • US20240421145A1 patent drawing
  • US20240421145A1 patent drawing
  • US20240421145A1 patent drawing

AI summary

A semiconductor structure includes a first circuit row including one or more first circuit cells and a second circuit row including one or more second circuit cells. At a cell boundary between the one or more first circuit cells in the first circuit row and the one or more second circuit cells in the second circuit row, one or more first gate regions of the one or more first circuit cells in the first circuit row are staggered with one or more second gate regions of the one or more second circuit cells in the second circuit row.