Staggered Grinding Material for Thick Portions Without Collapse

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Solution Overview

Problem

Conventional grinding materials face issues with increased aspect ratio leading to grinding portion collapse and warpage, reducing their lifespan and grinding efficiency.

Innovation Solution

The grinding portions are arranged in a staggered manner with controlled thickness ratios to prevent collapse and warpage, using a flexible base and specific abrasive grains to maintain grinding efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Duration of action of stationary object

If the height of the grinding portion is increased to extend the lifetime of the grinding material, then the lifetime is improved, but the aspect ratio of the grinding portion is increased causing the grinding portion to collapse during grinding

Engineering Contradiction:
Improvelifetime of grinding materialVSAvoidstability of grinding portion
Core Design Contradiction:
Duration of action of stationary objectVSStability of the object's composition

Solution Approach 1:

The invention transitions from a single-layer grinding structure to a multi-layer structure with a base layer and a grinding layer. This dimensional change allows the grinding portion height to be increased while the base layer provides support to prevent collapse, thus extending lifetime without compromising stability.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The invention uses a composite structure consisting of a base layer and a grinding layer with abrasive grains and binder. This composite material approach allows optimization of each layer's properties - the base layer provides structural support while the grinding layer provides grinding functionality, resolving the contradiction between height increase and collapse prevention.

Inventive Principle:
Principle #40Composite materials

2Stability of the object's composition

If the aspect ratio of the grinding portion is reduced to prevent collapse, then the stability is improved, but the area of each grinding portion is increased causing warpage of the base during printing or hardening

Engineering Contradiction:
Improvestability of grinding portionVSAvoidwarpage of base
Core Design Contradiction:
Stability of the object's compositionVSShape

Solution Approach 1:

The invention segments the grinding layer into multiple smaller grinding portions separated by grooves. This segmentation reduces the area of each individual grinding portion, preventing warpage of the base during printing and hardening, while maintaining stability through the staggered arrangement and controlled aspect ratio.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The invention applies different properties to different regions: the grinding portions have high hardness and abrasive content for grinding stability, while the grooves provide spacing to reduce warpage. This local quality differentiation allows each region to optimize its function without causing overall structural issues.

Inventive Principle:
Principle #3Local quality

3Shape

If the thickness of the base is increased to reduce warpage, then the shape stability is improved, but the flexibility and ductility of the base decrease making it difficult to follow the surface shape of the workpiece

Engineering Contradiction:
Improveflatness of baseVSAvoidflexibility to follow workpiece surface
Core Design Contradiction:
ShapeVSAdaptability or versatility

Solution Approach 1:

The invention optimizes the base thickness to a specific range (0.5-3.0mm) that balances flatness and flexibility. This parameter change allows the base to have sufficient thickness to reduce warpage while maintaining enough flexibility to follow the workpiece surface, resolving the contradiction between shape stability and adaptability.

Inventive Principle:
Principle #35Parameter changes

4Shape

If the thickness of the base is increased to reduce warpage, then the shape stability is improved, but the grinding rate decreases due to reduced flexibility

Engineering Contradiction:
Improveflatness of baseVSAvoidgrinding rate
Core Design Contradiction:
ShapeVSProductivity

Solution Approach 1:

The invention optimizes the base thickness parameter to a specific range (0.5-3.0mm) that maintains sufficient flexibility for high grinding rate while providing enough thickness to reduce warpage. This parameter optimization resolves the contradiction between shape stability and productivity.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration allows for increased thickness of grinding portions without reducing grinding rate, extending the material's lifespan and preventing base warpage.

Implementation Method 1

a grinding material containing fixed abrasive grains is used for processing a glass substrate

Methodology Applied
Scientific EffectAbrasion: Abrasion

Data Source

PatentEP3730245B1Grinding material
Publication Date: 2025.07.16 BANDO CHEM IND LTD
  • EP3730245B1 patent drawingFigure 1
  • EP3730245B1 patent drawingFigure 2
  • EP3730245B1 patent drawingFigure 3

AI summary

An object of the present invention is to provide a grinding material in which grinding portions can be increased in thickness while a decrease in grinding rate is inhibited. The grinding material according to the present invention includes a base, and a grinding layer overlaid on a front face side of the base and containing abrasive grains and a binder. The grinding layer includes a plurality of columnar grinding portions. The plurality of the grinding portions are configured so that the grinding portions are arranged in a staggered manner. The average thickness of the grinding portions is no less than 300 µm. The area of a top face of each of the grinding portions is no less than 6 mm2. The average thickness of the base is no less than 300 µm and no greater than 3,000 µm.