Staggered Heatsink and Card Guide for Pluggable Modules
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Solution Overview
Problem
Conventional card guide assemblies are not suitable for guiding pluggable electro-optic modules, and existing heatsink solutions are inefficient in cooling multiple modules due to airflow blockages, limiting the number of modules that can be plugged into a circuit pack.
Innovation Solution
A solderable surface-mounted card guide assembly and a staggered heatsink assembly are designed to securely mount and cool small-form factor pluggable electro-optic modules, using internally-slotted rails, tooling pins, solderable mounting tabs, and a staggered heatsink configuration with radiative fin structures to enhance airflow and heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If conventional card guide assemblies are used for circuit pack guidance, then board-level guidance is achieved, but they cannot provide module-level guidance for pluggable electro-optic modules and require board holes that block routing channels
Solution Approach 1:
The card guide assembly is segmented into multiple individual card guides, each capable of independently guiding a pluggable electro-optic module. This segmentation allows module-level guidance while maintaining board-level guidance capability, eliminating the need for board holes that block routing channels.
Solution Approach 2:
The card guides extend in a dimension perpendicular to the board surface, providing module-level guidance without requiring holes through the board. This dimensional change allows guidance functionality while preserving routing channel availability on the board.
2Quantity of substance
If multiple pluggable electro-optic modules are plugged into a circuit pack, then module density increases, but downstream heatsinks are blocked and starved of airflow
Solution Approach 1:
The heatsink assembly incorporates adjustable or movable components that can be dynamically positioned to optimize airflow paths. This dynamic adjustment allows downstream heatsinks to receive adequate airflow even when multiple modules are densely packed, preventing airflow starvation.
Solution Approach 2:
The heatsink assembly is pre-configured with optimized airflow channels and spacing before modules are installed. This preliminary configuration ensures that airflow paths are established in advance, allowing downstream heatsinks to receive adequate airflow from the start, preventing blocking issues.
3Loss of energy
If clip-on heatsinks are used with cage assemblies, then cooling is provided through convection, but the interface is limited and cannot transfer all heat when multiple modules are plugged in
Solution Approach 1:
The heatsink assembly merges multiple cooling mechanisms including conduction through thermally conductive materials, convection through optimized airflow paths, and radiation through radiative fin structures. This combination of cooling methods enables efficient heat transfer from multiple modules simultaneously, overcoming the limitations of clip-on heatsinks.
Solution Approach 2:
The heatsink assembly utilizes composite materials with high thermal conductivity, such as aluminum or copper alloys, to efficiently conduct heat from multiple modules. These composite materials provide enhanced heat transfer capability compared to conventional clip-on heatsink materials.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution allows for precise alignment and secure mounting of electro-optic modules without blocking board routing channels and enables efficient cooling of multiple modules, increasing the number that can be packed in a circuit pack without increasing airflow, thus maximizing optical transmitting/receiving capability in a compact volume.
Implementation Method 1
The radiative fin structure is coupled to the heatsink plate and is exposed to an air flow
Implementation Method 2
radiative fin structure
Implementation Method 3
the heatsink plate is in thermal communication with the associated pluggable electro-optic module
Data Source
AI summary
In various exemplary embodiments, the present invention provides improved card guide and heatsink assemblies for pluggable electro-optic modules utilized in optical communications networks and the like. More specifically, the present invention provides a solderable surface-mounted card guide assembly and a staggered heatsink assembly. These assemblies are utilized with small-form factor pluggable electro-optic modules and the like, and the concepts presented herein can be extended to XFP, XENPAK, XPAK, and X2 electro-optic modules, for example. The solderable surface-mounted card guide assembly of the present invention finds particular applicability with small-form factor pluggable electro-optic modules not utilizing any type of module cage, while the staggered heatsink assembly of the present invention finds particular applicability with small-form factor pluggable electro-optic modules both not utilizing and utilizing any type of module cage.