Staggered Vertical Interconnects for Misalignment-Tolerant Component Carriers
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The increasing miniaturization and complexity of electronic components on component carriers pose challenges in establishing efficient vertical electric connections while maintaining mechanical robustness and electrical reliability, especially under harsh conditions, and conventional methods suffer from alignment issues, delamination, and stress-related defects due to resin shrinkage.
Innovation Solution
The use of an intermediate structure with three or more staggered vertical interconnect elements embedded in a dielectric sheet, which mechanically and electrically couples component carriers, compensating for misalignment and reducing stress through a central stiffener and thin connection layers, allowing for compact and reliable signal propagation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional connection methods are used, then manufacturing is simpler, but alignment precision and electrical reliability deteriorate due to misalignment and delamination
Solution Approach 1:
An intermediate structure is introduced between the first and second component carriers to facilitate precise alignment and electrical connection. This intermediate structure includes a dielectric sheet with embedded conductive elements that act as a mediator, enabling accurate positioning and reducing misalignment issues while maintaining manageable device complexity through modular design.
Solution Approach 2:
The connection system is segmented into multiple functional layers: the first component carrier, the intermediate structure with dielectric sheet and conductive elements, and the second component carrier. This segmentation allows each layer to be optimized independently for its specific function, improving overall alignment precision without proportionally increasing total device complexity.
2Volume of moving object
If miniaturization is increased, then device size is reduced, but heat dissipation becomes more difficult and electrical reliability deteriorates
Solution Approach 1:
The intermediate structure employs local quality optimization by using a dielectric sheet with specific material properties in targeted areas to manage heat dissipation and maintain electrical reliability. The conductive elements are strategically positioned and sized to provide localized thermal pathways and electrical connections, enabling miniaturization while preserving reliability through localized material and structural optimization.
3Volume of moving object
If connection layers are made thinner, then device size is reduced, but mechanical strength and stress resistance deteriorate
Solution Approach 1:
The intermediate structure uses composite materials combining a dielectric sheet with embedded conductive elements. This composite construction provides both the thin profile needed for miniaturization and the mechanical strength required for stress resistance. The dielectric material provides structural integrity while the conductive elements provide electrical connection, achieving both thinness and strength through material composition rather than increasing thickness.
Data Source
AI summary
An electronic device includes a first component carrier having a first stack with at least one first electrically conductive layer structure and/or at least one first electrically insulating layer structure, a second component carrier having a second stack with at least one second electrically conductive layer structure and/or at least one second electrically insulating layer structure, and an intermediate structure including at least three staggered electrically conductive and coupled vertical interconnect elements in an at least partially dielectric sheet and being directly connected between the first component carrier and the second component carrier for electrically coupling the first component carrier with the second component carrier.