Staggered Electronic Interconnect Layout for Higher I/O Density

The patent transitions from a two-dimensional planar interconnect layout to a three-dimensional stacked configuration. Multiple layers of conductive segments are vertically arranged with staggered positioning, allowing I/O interconnects to extend through the vertical dimension. This enables increased I/O density without reducing the pitch geometry of individual interconnects, thereby maintaining solder joint reliability and manufacturability while achieving higher overall interconnect density.

The patent implements a nested structure where multiple conductive segments are arranged in stacked layers within a compact vertical space. Each layer contains conductive segments that are staggered relative to adjacent layers, creating a nested configuration that maximizes space utilization. This nested arrangement allows multiple I/O interconnects to be packed into a smaller footprint without requiring aggressive pitch down-scaling.

The patent utilizes the vertical dimension by implementing multiple stacked layers of conductive segments. This three-dimensional arrangement allows a high number of I/O interconnects to be accommodated within a compact horizontal footprint. The staggered configuration across layers enables efficient space utilization, achieving high I/O count without proportionally increasing the package and PCB area.

The patent divides the interconnect structure into multiple discrete layers of conductive segments. Each layer contains a subset of the total I/O interconnects, and the layers are stacked vertically with staggered arrangements. This segmentation allows the total I/O count to be distributed across multiple levels, enabling high I/O density within a reduced horizontal footprint compared to a single-layer configuration.

The patent segments the power and ground functions into separate dedicated layers. Power conductive segments are arranged in specific layers while ground conductive segments are arranged in adjacent layers, creating a controlled impedance structure. This segmentation improves power integrity by providing dedicated return paths and reducing electromagnetic interference, while the standardized stacked configuration maintains manufacturing simplicity through repeatable layering processes.

The patent introduces dielectric layers as intermediaries between conductive segments. These dielectric layers provide electrical isolation and controlled impedance matching between adjacent power and ground segments. The intermediary dielectric structure improves power integrity by preventing unwanted coupling and signal interference, while the use of standard dielectric materials and deposition processes maintains manufacturing simplicity.