Staggered Multilayer Connector for Compact Package Design
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Solution Overview
Problem
Conventional connectors tend to be large due to their design, leading to increased size of the package and electronic devices, which can result in protrusion and longer internal connecting terminals, making them unsuitable for compact applications.
Innovation Solution
A connector design featuring a multilayer dielectric substrate with first and second conductors arranged in a staggered configuration, utilizing a step portion and via hole conductors to reduce width and length, allowing for efficient high-frequency signal transmission while maintaining connectivity for both external leads and internal bonding wires.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the first and second external connecting terminals are disposed on separate planes (first flat portion and second flat portion), then the connector can accommodate both conductors, but the connector protrudes to the outside and becomes larger in size
Solution Approach 1:
The patent applies dimensionality change by transitioning from a two-dimensional planar arrangement to a three-dimensional stacked configuration. The first and second conductors are arranged on different layers (first dielectric layer and second dielectric layer respectively), with via hole conductors providing vertical connections between layers. This vertical stacking enables both external connecting terminals to be disposed on the same plane (third flat portion) while maintaining electrical connectivity, thereby eliminating protrusion and reducing connector size.
2Reliability
If the first and second internal connecting terminals are arranged along the frame on the same plane, then connectivity is maintained, but the arrangement length becomes longer
Solution Approach 1:
The patent reduces the length of internal connecting terminals by utilizing the vertical dimension through via hole conductors. Instead of arranging internal connecting terminals along the frame on the same plane, the first internal connecting terminal is disposed on the first dielectric layer and the second internal connecting terminal is disposed on the second dielectric layer. The via hole conductors provide vertical electrical connections between these layers, significantly shortening the path length while maintaining reliable electrical connectivity.
3Volume of moving object
If via hole conductors are used to penetrate through dielectric layers, then the connector width can be reduced, but manufacturing complexity increases
Solution Approach 1:
The patent reduces connector width by arranging conductors on multiple stacked layers connected by via hole conductors. This vertical integration allows horizontal space to be minimized while maintaining all necessary electrical connections. The via hole conductors penetrate through the dielectric layers vertically, enabling compact horizontal footprint.
Solution Approach 2:
The connector is segmented into multiple functional layers: first dielectric layer with first conductor, second dielectric layer with second conductor, and third dielectric layer with external connecting terminals. Each layer performs a specific function, and via hole conductors provide inter-layer connectivity. This segmentation allows optimized space utilization and simplified manufacturing processes for each layer.
Data Source
Figure 1(a)~1(b)
Figure 2
Figure 3(a)~3(b)
AI summary
A connector which can be made compact is provided. A package and an electronic device which can be made compact by using the connector are also provided. The connector has a first conductor and a second conductor for connecting an internal circuit formed in a frame-shaped container and an external circuit provided outside of the container, comprising: a stacked body comprising a plurality of dielectric layers and having a first top surface, a second top surface positioned at a height different from that of the first top surface and a bottom surface positioned opposite to the second top surface; a first conductor comprising a first external connecting terminal disposed on the first top surface of the stacked body and for connecting to the external circuit, and a first internal connecting terminal disposed on the first top surface of the stacked body and for connecting to the internal circuit; and a second comprising a second internal connecting terminal disposed on the second top surface and for connecting to the internal circuit, and a second external connecting terminal disposed on the bottom surface and for connecting to the external circuit.