Staggered Multi-Channel Optical Transceiver Assembly for Dense Packaging
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Solution Overview
Problem
The traditional optical transmitting assembly occupies a large space, making it difficult to expand the number of channels in optical communication devices.
Innovation Solution
A multi-channel optical transceiver assembly with a staggered arrangement of optical-transmitting and optical-receiving assemblies on a conductive substrate, utilizing a multi-layer ceramic substrate with different heights and configurations to accommodate more channels for emitting and receiving light within a limited space. The optical-transmitting assembly and the optical-receiving assembly are arranged in a staggered manner, with the optical-transmitting assembly and the optical-receiving assembly arranged in a staggered manner along a second direction perpendicular to the first direction, and both directions parallel to the upper surface of the base.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If traditional BOX packaging method with two casings is used, then optical transmitting and receiving functions are achieved, but the arrangement occupies a large space making it difficult to expand channels
Solution Approach 1:
The patent merges the optical transmitting assembly and optical receiving assembly into a single integrated housing structure. The transmitting assembly includes laser chips arranged on a base, while the receiving assembly includes photodetector chips arranged on a circuit board. Both assemblies share the same housing and spatial envelope, eliminating the need for separate BOX casings. This integration reduces the overall space occupation while maintaining full transmitting and receiving functionality, thereby enabling channel expansion without proportionally increasing assembly size.
Solution Approach 2:
The patent employs three-dimensional spatial arrangement within the housing, utilizing vertical stacking and layered positioning of components. The base and circuit board are positioned at different heights, with optical paths routed through multiple dimensions. This dimensional utilization allows dense packing of multiple channels (e.g., 8-channel or 16-channel configurations) within a compact footprint, transforming the traditional two-dimensional planar layout into a three-dimensional space-efficient architecture.
2Productivity
If the number of channels is increased in traditional assembly, then bandwidth is improved, but the spacing requirements between channels increase the overall assembly size
Solution Approach 1:
The patent implements a nested arrangement where multiple optical channels are packed within a shared housing envelope. The transmitting and receiving assemblies are nested within the same spatial boundary, with sub-components (laser chips, photodetector chips, optical paths) nested within their respective assemblies. This nested structure allows high channel counts to be achieved without linearly increasing the external dimensions of the assembly.
Solution Approach 2:
The patent segments the optical system into modular functional units: laser chips for transmitting, photodetector chips for receiving, and integrated optical paths. Each channel can be independently configured and positioned, allowing flexible arrangement to maximize space utilization. The segmentation enables precise positioning of components to minimize spacing requirements while maintaining channel isolation and performance.
Data Source
AI summary
A multi-channel light receiving/transmitting assembly and an optical module. The multi-channel light receiving/transmitting assembly comprises a base (310), a conductive substrate, a light transmitting assembly, and a light receiving assembly; the conductive substrate is at least partially connected with the base (310); the light transmitting assembly is used for transmitting an optical signal, and the light transmitting assembly comprises at least two laser chips (510), wherein the laser chips (510) are arranged on the base (310) in parallel in a first direction (X) and are respectively electrically connected with the conductive substrate; the light receiving assembly is used for receiving an externally inputted optical signal, and the light receiving assembly comprises at least two light receiving chips (610), wherein the light receiving chips (610) are arranged on the conductive substrate in parallel in the first direction (X) and are respectively electrically connected with the conductive substrate; the light transmitting assembly and the light receiving assembly are staggered in a second direction (Y), the second direction (Y) is perpendicular to the first direction (X), and the second direction (Y) and the first direction (X) are both parallel to the upper surface of the base (310), so as to solve the technical problem of difficulty in expanding more channels due to the fact that a device of a traditional light transmitting assembly occupies a relatively large space.