Staggered Power Bar Terminal in IC Lead Frame Packaging
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Solution Overview
Problem
Current integrated circuit packaging systems face limitations in I/O connections, power delivery, and heat dissipation due to the peripheral lead frame structure, which restricts the number of connections, current supply, and thermal efficiency.
Innovation Solution
The implementation of a staggered power bar terminal and signal contacts within an integrated circuit packaging system, where the power bar terminal is positioned relative to the signal contacts, allowing for increased connection density and reduced risk of solder bridging, along with a package body that partially covers these components for protection and structural support.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If power connections are made through peripheral pins like I/O pins, then the package structure is simple, but the current delivery capability is limited due to long wire paths
Solution Approach 1:
The patent transitions from peripheral pin connections (1D arrangement around the edge) to a centralized power bar terminal (2D/3D arrangement at the center), fundamentally changing the spatial dimension of power connections. This allows direct vertical access to the die center, eliminating long peripheral wire paths and enabling high current delivery through thick metal traces and bonds directly to the die center.
2Quantity of substance
If I/O connections are arranged around the periphery of the lead frame, then the package structure is simple, but the number of I/O connections is limited
Solution Approach 1:
The patent moves connection points from the 1D peripheral edge to the 2D/3D central region, where multiple signal contacts and power bar terminals can be densely arranged in a grid-like pattern. This dimensional shift enables significantly higher connection density without increasing package footprint, as connections are distributed across the central area rather than constrained to the perimeter.
3Temperature
If the die is attached to a pad in the lead frame, then the attachment process is simple, but heat dissipation is impeded by poor thermal connections to the printed circuit board
Solution Approach 1:
The patent extracts the thermal management function from the peripheral lead frame structure and concentrates it in the centralized power bar terminal region. The power bar terminal serves dual purposes: electrical power connection and thermal conduction. By positioning the die attachment point at the center where the power bar terminal provides direct PCB connection, heat can be efficiently conducted from the die through the power bar terminal to the PCB, creating a dedicated thermal pathway independent of the peripheral lead frame.
Data Source
AI summary
A method of manufacture of an integrated circuit packaging system includes: forming signal contacts; forming a power bar having a power bar terminal, the power bar terminal formed in a staggered position relative to the signal contacts; depositing a terminal pad on the power bar terminal; depositing a contact pad on one of the signal contacts; coupling an integrated circuit die to the power bar terminal and the signal contacts; and forming a package body on the integrated circuit die.