Staggered Print Head Dies With Asymmetric Interconnects
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Solution Overview
Problem
Inkjet printers with stationary media wide printhead assemblies face challenges in reducing print quality defects due to the spacing between print head dies, which affects dot placement accuracy and color mixing, especially when using multiple colors.
Innovation Solution
The implementation of a page-wide array of staggered and overlapping print head dies with electrical interconnects that do not obstruct the overlap, allowing for closer spacing of print head dies and improved thermal control through strategic placement of temperature sensors and ink feed slots, optimizing ink ejection and color saturation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If print head dies are spaced further apart to avoid obstruction by electrical interconnects, then ease of manufacture is improved, but manufacturing precision deteriorates due to increased spacing between dies affecting dot placement accuracy
Solution Approach 1:
The patent transitions from linear spacing to two-dimensional staggered and overlapping arrangement of print head dies. The electrical interconnect is positioned on one side of each die while nozzles are positioned on the other side, allowing dies to overlap in the media path direction without electrical interconnect obstruction, thus achieving closer effective spacing while maintaining manufacturing feasibility
Solution Approach 2:
The patent employs asymmetric positioning where electrical interconnects are located on one side of each print head die and nozzles are located on the opposite side. This asymmetric layout allows the interconnect to be positioned outside the overlap zone with adjacent dies, enabling closer spacing without interference while maintaining ease of electrical connection
2Manufacturing precision
If print head dies are spaced closer together to improve dot placement accuracy, then manufacturing precision is improved, but device complexity increases due to overlapping configurations and thermal management requirements
Solution Approach 1:
The print bar is segmented into multiple discrete print head dies that can be independently manufactured and then assembled in a staggered overlapping configuration. Each die is a separate unit with its own electrical interconnect and nozzle array, allowing for modular assembly that achieves close spacing while maintaining individual die simplicity
Solution Approach 2:
The patent introduces temperature sensors as intermediary elements positioned between adjacent print head dies to monitor and manage thermal interactions. These sensors enable active thermal control that prevents overheating in the close-spaced overlapping configuration, making the complex arrangement manageable
3Productivity
If electrical interconnects are positioned to allow overlapping of print head dies, then productivity is improved through reduced print zone width, but device complexity increases due to strategic placement requirements for interconnects and sensors
Solution Approach 1:
The patent utilizes the second dimension (width direction perpendicular to media path) to position electrical interconnects outside the overlap zone. By arranging interconnects on one side of each die and nozzles on the opposite side, the design allows dies to overlap in the media path direction without electrical interference, reducing print zone width and improving productivity
Solution Approach 2:
Different regions of the print head assembly are assigned different functions: one side of each die is dedicated to electrical interconnection while the opposite side is dedicated to nozzle positioning. This local specialization allows optimal positioning for each function, enabling close spacing without compromising electrical connectivity or print quality
4Reliability
If temperature sensors are strategically placed to improve thermal control in overlapping configurations, then reliability is improved through better thermal management, but device complexity increases due to additional sensor placement requirements
Solution Approach 1:
Temperature sensors are positioned as intermediary monitoring elements between adjacent print head dies in the overlapping configuration. These sensors detect thermal conditions in the close-spaced regions where thermal management is most critical, enabling active control that improves reliability without requiring fundamental redesign of the thermal conduction paths
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances dot placement accuracy, reduces print zone width, and improves color mixing and saturation, leading to better print quality by allowing closer spacing of print head dies and efficient thermal management.
Implementation Method 1
obtaining temperature information from a temperature sensor formed on the substrate adjacent to a first liquid feed slot
Implementation Method 2
firing actuators on the substrate corresponding to the nozzles. The determined operating energy for the first ink supplied by the first liquid feed slot is used to fire the firing actuators
Implementation Method 3
a substrate having liquid feed slots formed therein extending along a major dimension of the substrate
Data Source
AI summary
Staggered fluid ejection dies may include first, second and third fluid ejection dies, each of the dies having fluid feed passages between first and second long edges. And electrical interconnect may extend from a location proximate the first long edge of each of the fluid ejection dies. A temperature sensor may be supported proximate the second long edge of each of the fluid ejection dies. Each of the fluid ejection dies may omit temperature sensors proximate the first long edge.