Staggered Probe Mounting for Density and Durability
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Solution Overview
Problem
Current semiconductor device testing methods face challenges in increasing probe capacity, density, and durability, leading to probe fatigue, deformation, and fracture failures during wafer testing.
Innovation Solution
The development of a probe card assembly with a multi-layer ceramic substrate and probes featuring a two-support structure design, which includes a mounting portion, a beam with a narrowing region, and a contact tip structure, allowing for increased probe density and similar spring constants across probes, thereby enhancing durability and reducing failure rates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If probe density is increased to improve testing capacity, then probe fatigue and fracture failures increase
Solution Approach 1:
The probe support structure is divided into multiple discrete support structures distributed across the substrate, with each support structure providing localized support to multiple probes. This segmentation allows increased probe density while distributing mechanical stresses across multiple support points, preventing localized fatigue and fracture failures.
Solution Approach 2:
Different regions of the substrate are assigned different support structure configurations based on local probe density requirements. Areas with higher probe density receive enhanced support structure density, while maintaining uniform spring constants through careful design of each local support region's geometry and material properties.
2Productivity
If probe capacity is increased to test more devices, then probe strength and durability decrease
Solution Approach 1:
Multiple probes are merged onto a single support structure, with each support structure providing combined support to multiple probes. This merging approach increases overall probe capacity while maintaining individual probe strength through the distributed support architecture, allowing more devices to be tested without compromising individual probe durability.
3Productivity
If probe density is increased to improve testing efficiency, then uniformity of contact characteristics becomes difficult to maintain
Solution Approach 1:
The geometry and material properties of the support structures are carefully designed and adjusted to compensate for varying probe positions and densities. By optimizing parameters such as support structure height, width, and spacing, uniform spring constants and contact characteristics are maintained across all probes despite increased density and varied manufacturing tolerances.
Data Source
AI summary
A probe group can include multiple probes for testing devices having contact pads. The probes can comprise beams, contact tip structures, and mounting portions. The beams can provide for controlled deflection of the probes. The contact tip structures can be connected to the beams and can include contact portions for contacting with the devices. The mounting portions of the beams can be attached to support structures, which can be arranged in a staggered pattern. The beams located in a first row of the staggered pattern can include narrowing regions that lie substantially in line with the mounting portions of a second row of the beams.