Staggered RGB Chip Stacking for Compact LED Pixel Layouts

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Solution Overview

Problem

Existing LED display devices require red, green, and blue LED chips to be placed side by side on a circuit substrate, occupying more space and leading to inefficiencies in pixel image generation.

Innovation Solution

A staggered stacked light-emitting chip structure is developed, where three light-emitting chips (red, green, and blue) are stacked sequentially from bottom to top and horizontally staggered from each other, minimizing mutual optical influence and space occupancy.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If red, green, and blue LED chips are placed side by side on a circuit substrate, then pixel image generation can be achieved, but the space occupied is larger

Engineering Contradiction:
Improvepixel image generationVSAvoidspace occupancy
Core Design Contradiction:
Ease of manufactureVSArea of stationary object

Solution Approach 1:

The patent transitions from a two-dimensional side-by-side arrangement of LED chips to a three-dimensional stacked configuration. Multiple LED chips (red, green, blue) are vertically stacked and horizontally staggered, utilizing the vertical dimension to reduce the horizontal footprint while maintaining the ability to generate pixel images through cooperative emission

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Area of stationary object

If LED chips are stacked closely to reduce space, then space occupancy is reduced, but mutual optical influence between chips increases

Engineering Contradiction:
Improvespace occupancyVSAvoidmutual optical influence
Core Design Contradiction:
Area of stationary objectVSObject-affected harmful factors

Solution Approach 1:

The patent employs asymmetric horizontal staggering of LED chips in the stacked configuration. Each LED chip is positioned at a different horizontal offset relative to the others, creating an asymmetric arrangement that prevents direct optical alignment between chips while maintaining compact vertical stacking, thus reducing mutual optical interference

Inventive Principle:
Principle #4Asymmetry

Solution Approach 2:

The patent performs preliminary optical design by pre-calculating and pre-positioning LED chips at specific staggered locations before manufacturing. The horizontal offsets are predetermined to ensure that optical paths do not intersect, preventing mutual optical influence before the chips are even assembled

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The staggered stacked light-emitting chip structure reduces the mutual optical influence between the LED chips, allowing for more efficient use of space and improved pixel image generation in LED display devices.

Implementation Method 1

a first light-emitting chip, a second light-emitting chip and a third light-emitting chip are stacked sequentially from bottom to top, and the first light-emitting chip, the second light-emitting chip and the third light-emitting chip are horizontally staggered from each other

Methodology Applied
Scientific EffectLight emission: Light Emitting Diode

Data Source

PatentUS20250062294A1Staggered stacked light-emitting chip structure, method of manufacturing the same, and image display device using the same
Publication Date: 2025.02.20 ASTI GLOBAL INC
  • US20250062294A1 patent drawing
  • US20250062294A1 patent drawing
  • US20250062294A1 patent drawing

AI summary

A staggered stacked light-emitting chip structure and a method of manufacturing the same, and an image display device are provided. The staggered stacked light-emitting chip structure includes a first light-emitting chip, a second light-emitting chip and a third light-emitting chip. The first, second and third light-emitting chips are stacked sequentially from bottom to top and horizontally staggered from each other. The vertical projection of the second positive electrode pad and the vertical projection of the second negative electrode pad of the second light-emitting chip do not fall on the first top light-emitting surface of the first light-emitting chip. The vertical projection of the third positive electrode pad and the vertical projection of the third negative electrode pad of the third light-emitting chip do not fall on the first top light-emitting surface of the first light-emitting chip and the second top light-emitting surface of the second light-emitting chip.