Staggered Semiconductor Terminal Rows for Compact Power Conversion
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing power conversion apparatuses face challenges in reducing the size of circuit boards while maintaining sufficient creepage distance between semiconductor module terminal rows, which restricts the layout flexibility and space for mounting other electronic components.
Innovation Solution
The semiconductor modules are arranged with their signal terminals in a staggered manner along perpendicular directions, allowing for a compact circuit board design with adequate creepage distance and increased space for mounting other components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If upper arm semiconductor module and lower arm semiconductor module are aligned along the terminal arranging direction to reduce the dimension in that direction, then the distance between terminal rows is reduced, but the creepage distance between terminal rows becomes insufficient
Solution Approach 1:
The patent applies dimensional transformation by changing the arrangement pattern from linear alignment along the terminal arranging direction (first direction) to staggered arrangement along the width direction (second direction perpendicular to the first direction). This repositions terminal rows in a different spatial dimension, allowing the distance between terminal rows in the terminal arranging direction to be reduced while maintaining adequate creepage distance through the staggered configuration across the width direction.
Solution Approach 2:
The patent introduces asymmetric arrangement by staggering the terminal rows of upper arm and lower arm semiconductor modules relative to each other in the width direction. Instead of symmetric alignment where terminal rows would be directly opposite, the asymmetric staggered positioning creates offset arrangements that provide sufficient creepage distance while enabling compact dimensional layout.
2Area of stationary object
If the distance between upper arm terminal row and lower arm terminal row is reduced to make the circuit board compact, then the dimension in terminal arranging direction is reduced, but the space for mounting other electronic components is restricted
Solution Approach 1:
The patent utilizes the width direction (second direction) as an additional spatial dimension for arranging terminal rows. By distributing terminal rows staggered across the width direction rather than concentrating them along the terminal arranging direction, the patent creates available space in the terminal arranging direction for mounting other electronic components, thereby improving layout flexibility while maintaining compact overall area.
Solution Approach 2:
The patent segments the terminal row arrangements into distinct staggered groups along the width direction, creating separate zones that can be independently utilized. This segmentation allows certain regions to be dedicated to terminal connections while other regions become available for mounting additional electronic components, enhancing the overall adaptability of the circuit board layout.
Data Source
AI summary
The power conversion apparatus includes semiconductor modules and a circuit board on which a control circuit is formed. Each semiconductor module includes signal terminals electrically connected to the circuit board. The signal terminals of each semiconductor module are arranged in a line so as to form a terminal row along a first direction. The semiconductor modules are grouped into upper arm semiconductor modules and lower arm semiconductor modules each connected to a corresponding one of the upper arm semiconductor module. Upper arm terminal rows as the terminal rows of the upper arm semiconductor modules and lower arm terminal rows as the terminal rows of the lower arm semiconductor modules are arranged in a staggered manner along a second direction perpendicular to the first direction and to a third direction in which the signal terminals of the semiconductor modules project, the first, second and third directions being perpendicular to one another.


