Staggered Through-Hole Structure in Multilayer Coils for Higher SRF

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Solution Overview

Problem

Existing multilayer coil components face issues with product deformation and a decline in self-resonant frequency due to increased conductor volume and stray capacitance between coil and through hole patterns.

Innovation Solution

The multilayer coil component design includes a through hole connecting portion formed by shifting through hole patterns in the lamination direction, ensuring they are positioned farther from coil patterns to reduce conductor volume and stray capacitance, with specific patterns and layer configurations to maintain conductivity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If through hole patterns are linearly continuous at the same position in the lamination direction, then electrical conductivity is ensured, but conductor volume increases causing product deformation

Engineering Contradiction:
Improveelectrical conductivityVSAvoidconductor volume
Core Design Contradiction:
ReliabilityVSVolume of stationary object

Solution Approach 1:

The patent applies dimensionality change by shifting through hole patterns in the lateral direction (X or Y axis) across different layers instead of maintaining linear continuity in the lamination direction (Z axis). This transforms the conductor path from a vertical linear arrangement to a staggered three-dimensional configuration, reducing the concentration of conductor volume at any single location while maintaining electrical connectivity across layers.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Ease of manufacture

If through hole patterns are positioned close to coil patterns, then manufacturing is simplified, but stray capacitance increases causing decline in self-resonant frequency

Engineering Contradiction:
Improvepattern alignmentVSAvoidself-resonant frequency
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The patent employs asymmetry by intentionally creating an asymmetric spatial relationship between through hole patterns and coil patterns. The through hole patterns are positioned at asymmetric offsets in the lateral direction relative to the coil patterns, maximizing the separation distance. This asymmetric positioning reduces the electromagnetic coupling and stray capacitance between the through hole conductors and the coil windings, thereby maintaining high self-resonant frequency.

Inventive Principle:
Principle #4Asymmetry

Data Source

PatentUS12354786B2Multilayer coil component
Publication Date: 2025.07.08 TDK CORP
  • US12354786B2 patent drawing
  • US12354786B2 patent drawing
  • US12354786B2 patent drawing

AI summary

A multilayer coil component includes: a through hole connecting portion electrically connecting an end portion of the coil portion and the external terminal, in which a coil pattern and a through hole pattern are formed in each of the plurality of layers, the through hole connecting portion is formed by mutually joining a plurality of the through hole patterns in the lamination direction, the through hole pattern in at least one first layer among the plurality of layers is shifted with respect to the through hole pattern in another second layer when viewed from the lamination direction, and, when viewed from the lamination direction, a distance between the through hole pattern in the first layer and a coil pattern in the first layer is farther than a distance between the through hole pattern in the second layer and the coil pattern in the first layer.