Water-Filled Stainless Cooling Panel for Phase-Change Heat Dissipation
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Solution Overview
Problem
Existing heat dissipation systems for electronic devices, particularly those using aluminum alloys, face limitations in thermal conductivity, material restrictions, and increased product size, and are challenged by the use of restricted refrigerants that may harm the environment.
Innovation Solution
The use of stainless steel (SUS) as a thermal conduction panel body filled with water as a refrigerant, which changes phases to enhance heat dissipation performance, while avoiding chemical reactions and adhering to environmental regulations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If aluminum alloy is used as thermal conduction material, then thermal conductivity is improved, but material restrictions and chemical reaction risks increase
Solution Approach 1:
The patent changes the material parameter from aluminum alloy to stainless steel (SUS), which has lower thermal conductivity but eliminates chemical reaction risks with water refrigerant. This parameter change resolves the contradiction by prioritizing reliability over maximum thermal conductivity, while still achieving effective heat dissipation through the phase change mechanism.
Solution Approach 2:
The patent introduces water as an intermediary refrigerant that undergoes phase change to transfer heat from the stainless steel thermal conduction panel. This intermediary mechanism compensates for the lower thermal conductivity of stainless steel compared to aluminum alloy, resolving the contradiction between material reliability and thermal performance.
2Temperature
If restricted refrigerants are used, then heat dissipation performance is improved, but environmental harm increases
Solution Approach 1:
The patent converts the previously harmful restricted refrigerants into beneficial environmentally friendly water-based refrigerant. By utilizing water's phase change properties (liquid to vapor and back), the system achieves effective heat dissipation without the environmental harm associated with restricted refrigerants, thus resolving the contradiction between performance and environmental impact.
Solution Approach 2:
The patent changes the refrigerant parameter from restricted substances to water, which has favorable environmental characteristics. This parameter change maintains heat dissipation performance through phase change while eliminating environmental harm, directly resolving the technical contradiction.
3Temperature
If traditional heat dissipation structures are used, then manufacturing simplicity is maintained, but heat dissipation performance is insufficient
Solution Approach 1:
The patent merges the thermal conduction panel and refrigerant chamber into an integrated active heat dissipation apparatus. The stainless steel panel serves dual functions as both heat conduction structure and sealed container for the water refrigerant, reducing overall structural complexity while enhancing heat dissipation performance through active phase change mechanism.
Solution Approach 2:
The patent replaces traditional passive mechanical heat dissipation structures (heat sinks, fans) with an active thermodynamic system utilizing phase change. This substitution achieves superior heat dissipation performance without proportionally increasing structural complexity, as the phase change mechanism provides active cooling control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach improves heat dissipation performance, reduces manufacturing costs, and expands refrigerant options beyond environmentally harmful substances, ensuring effective and economical heat management.
Implementation Method 1
a refrigerant with which the refrigerant flow space of the thermal conduction panel body is filled, in which the refrigerant is water that is changed in phase from a liquid state to a gaseous state or from a gaseous state to a liquid state by thermal conductivity of the thermal conduction panel body
Implementation Method 2
the thermal conduction panel body is made of a metallic material capable of transferring heat into the refrigerant flow space from the outside
Data Source
AI summary
The present disclosure relates to an active heat dissipation apparatus and a method of manufacturing the same, and an active heat dissipation apparatus according to the present disclosure includes a thermal conduction panel body having therein a refrigerant flow space having a predetermined thickness, and a refrigerant with which the refrigerant flow space of the thermal conduction panel body is filled, in which the thermal conduction panel body is made of a metallic material capable of transferring heat into the refrigerant flow space from the outside, and in which the refrigerant is water that is changed in phase from a liquid state to a gaseous state or from a gaseous state to a liquid state by thermal conductivity of the thermal conduction panel body, thereby significantly improving heat dissipation performance.