Stair Step Electrical Interconnects Eliminate Capacitive Stub Signal Degradation

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Solution Overview

Problem

Existing electrical interconnection technologies suffer from signal degradation due to capacitive stubs and parasitic capacitance, which compromise signal integrity in electronic systems.

Innovation Solution

The implementation of stair step electrical connection structures that eliminate the need for vias and plated through holes, utilizing curved conductive elements with tapered ends and angled walls to establish contact without capacitive stubs, ensuring optimal signal integrity by minimizing parasitic capacitance and maximizing contact force.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If vias and plated through holes are used to establish electrical connections, then mechanical anchoring and electrical connectivity are achieved, but capacitive stubs and parasitic capacitance are introduced causing signal degradation

Engineering Contradiction:

Improvesignal integrityVSAvoidcapacitive stubs and parasitic capacitance

Core Design Contradiction:

ReliabilityVSObject-generated harmful factors

Solution Approach 1:

The patent removes the harmful via structure from the electrical connection path. Instead of using plated through holes that create capacitive stubs, the invention uses surface-mounted conductive elements that eliminate the need for vias, thereby extracting the harmful capacitive effect from the system while maintaining electrical connectivity

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

Instead of creating electrical connections through the board thickness (via plated through holes), the patent inverts the approach by establishing connections at the surface level using conductive elements that make contact at the interface, reversing the traditional connection topology to eliminate capacitive stubs

Inventive Principle:

Principle #13The other way round (Inversion)

2Reliability

If conventional electrical contact structures are used, then electrical connectivity is established, but contact force and contact wipe are insufficient leading to poor corrosion resistance

Engineering Contradiction:

Improvecorrosion resistanceVSAvoidcontact force and contact wipe

Core Design Contradiction:

ReliabilityVSForce

Solution Approach 1:

The patent employs curved contact surfaces on the conductive elements instead of flat or pointed contacts. The curved geometry increases the contact area and distributes contact force more effectively, enhancing both contact force and contact wipe capability while improving corrosion resistance through better mechanical engagement

Inventive Principle:

Principle #14Spheroidality (Curvature)

Solution Approach 2:

The conductive elements are constructed with composite material structures that combine different materials to optimize both electrical conductivity and mechanical properties. This allows the contact surfaces to provide adequate contact force and wipe capability while maintaining excellent corrosion resistance

Inventive Principle:

Principle #40Composite materials

3Reliability

If redundant contact points are added to eliminate capacitive stubs, then signal integrity is improved, but device complexity increases

Engineering Contradiction:

Improvesignal integrityVSAvoidcontact structure complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent combines multiple functions into the conductive elements themselves. The same conductive elements that provide electrical connectivity also serve as the contact force application points and corrosion-resistant surfaces, merging what would traditionally be separate components into a unified structure that reduces overall device complexity

Inventive Principle:

Principle #5Merging (Combining)

Data Source

PatentUS7651382B2Electrical interconnection devices incorporating redundant contact points for reducing capacitive stubs and improved signal integrity

Publication Date: 2010.01.26 SAMSUNG ELECTRONICS CO LTD

AI summary

An electrical interconnection device for establishing redundant contacts between the ends of two conductive elements to be mated, creating a electrical interconnection without capacitive stubs.