Staircase Post Wall Waveguide Layout for Better RF Transmission

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Solution Overview

Problem

The existing post wall waveguide has suboptimal radio wave transmission characteristics due to its shape being close to a rectangular waveguide.

Innovation Solution

A wiring board design incorporating a built-in post wall waveguide with a staircase-shaped laminate of via interconnects across multiple insulating layers, where the intervals between adjacent via interconnects are varied to resemble a circular waveguide configuration, improving transmission characteristics.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the post wall waveguide is formed with via interconnects arranged in a rectangular pattern, then the manufacturing process is simple, but the radio wave transmission characteristics are suboptimal

Engineering Contradiction:
Improveradio wave transmission characteristicsVSAvoidvia interconnect arrangement complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent applies the spheroidality principle by transitioning from a rectangular via interconnect arrangement to a circular pattern. The via interconnects are arranged in a circular configuration rather than a rectangular grid, which transforms the waveguide's cross-sectional shape from rectangular to circular. This curvature change improves radio wave transmission characteristics by reducing impedance discontinuities and improving field distribution, while the circular pattern can still be manufactured using standard via drilling and plating processes.

Inventive Principle:
Principle #14Spheroidality (Curvature)

2Reliability

If the interval between adjacent via interconnects is uniform, then the manufacturing precision is easier to maintain, but the transmission characteristics are degraded

Engineering Contradiction:
Improvetransmission characteristicsVSAvoidvia interconnect spacing precision
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The patent applies the local quality principle by implementing non-uniform spacing of via interconnects within the circular arrangement. Specifically, the spacing between adjacent via interconnects varies depending on their position in the circular pattern. This local variation in spacing is optimized to improve transmission characteristics by better matching impedance and reducing reflections, while each local spacing value can still be controlled within standard manufacturing tolerances.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The modified waveguide structure enhances radio wave transmission by mimicking a circular waveguide shape, leading to improved transmission characteristics compared to traditional rectangular waveguide designs.

Implementation Method 1

serving as a transmission path for electromagnetic waves

Methodology Applied
Scientific EffectElectromagnetic wave transmission: Electromagnetic Induction

Data Source

PatentUS12506241B2Wiring board comprising three or more insulating layers, where a post wall waveguide of staircase shape is formed therein
Publication Date: 2025.12.23 SHINKO ELECTRIC IND CO LTD
  • US12506241B2 patent drawing
  • US12506241B2 patent drawing
  • US12506241B2 patent drawing

AI summary

A wiring board has a built-in post wall waveguide having a region surrounded by two mutually opposing conductors and first and second post walls connecting the two conductors and serving as a transmission path for electromagnetic waves. The conductors oppose each other with insulating layers interposed therebetween. The first post wall has first columnar portions, formed by a laminate of via interconnects penetrating the insulating layers, arranged at predetermined intervals in a first direction in which the electromagnetic waves are transmitted. The second post wall has second columnar portions similar to the first columnar portions. In a cross sectional view taken in a second direction perpendicular to the first direction, an interval between adjacent via interconnects in one of the insulating layers not in contact with the conductor is wider than an interval between adjacent via interconnects in two of the insulating layers in contact with the two conductors, respectively.