Stamp-Based Wettability Control for Organic Optoelectronic Patterning
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Solution Overview
Problem
Inkjet printing of organic opto-electrical devices faces challenges such as non-uniform film formation and shorting due to the organic hole injecting layer extending beyond the conductive layer, and difficulties in filling large wells with solution processed electrically active material, leading to incomplete wetting and inaccurate patterning.
Innovation Solution
A process involving a stamp with a distal surface that decreases wettability is used to prevent the electrically active material from flowing over bank structures, ensuring it remains within defined wells, allowing for accurate positioning and complete wetting without complex bank structures or formulations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If inkjet printing is used to deposit organic materials, then material can be deposited selectively in wells, but the organic hole injecting layer extends beyond the conductive layer causing non-uniform film formation and shorting
Solution Approach 1:
A stamp structure is introduced as an intermediary between the inkjet printing process and the substrate. The stamp receives the deposited organic material and prevents it from extending beyond the conductive layer, thereby eliminating shorting while maintaining selective deposition capability
Solution Approach 2:
The device structure is segmented by introducing a stamp that physically separates the conductive layer from the organic hole injecting layer. This segmentation prevents the organic material from shorting to the conductive layer while allowing selective material deposition
2Manufacturing precision
If complex bank structures or formulations are used to contain material in wells, then material can be prevented from flowing over, but the manufacturing process becomes more complex
Solution Approach 1:
The containment function is extracted from the bank structure and transferred to a separate stamp component. This allows the banks to remain simple while the stamp provides the necessary material containment through its physical presence and geometry
Solution Approach 2:
The stamp serves as an intermediary structure that simplifies the overall system by providing material containment without requiring complex bank structures. The stamp's simple geometry achieves containment while reducing manufacturing complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables uniform film formation within wells, prevents shorting, and allows for more material to be deposited accurately, ensuring complete coverage of underlying layers while maintaining simplicity and cost-effectiveness in manufacturing.
Implementation Method 1
bringing a stamp into contact with the substrate whereby areas of the substrate contacted by the stamp have decreased wettability
Data Source
AI summary
A process for manufacturing an electrical device, the process comprising the steps: providing a substrate; bringing a stamp into contact with the substrate whereby areas of the substrate contacted by the stamp have decreased wettability; and depositing a liquid comprising an electrically active material over areas of the substrate located between the areas of decreased wettability.