Stamped Interconnect Plate Assembly for Thin SOFC Flow Channels
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Solution Overview
Problem
Conventional methods for preparing planar interconnect plates for solid oxide fuel cells require thick plates and involve time-consuming mechanical engraving, making them costly and inefficient.
Innovation Solution
A method involving a stamping process to form modular planar interconnect plates with upper and lower main channels, using a metal blank sheet stamped to create protrusions and depressions, allowing for fluid channels without the need for mechanical engraving.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If mechanical engraving is used to form fluid channels on planar interconnect plates, then fluid channels can be created, but the processing time increases and production cost increases
Solution Approach 1:
The patent replaces mechanical engraving with a stamping process. A stamping assembly with a stamping member is pressed against the planar interconnect plate to directly form fluid channels through plastic deformation, eliminating the need for time-consuming mechanical engraving operations while reducing manufacturing complexity
Solution Approach 2:
The patent changes the manufacturing approach from subtractive (engraving) to formative (stamping). By applying controlled pressure through the stamping assembly, material is plastically deformed to create fluid channels, changing the fundamental manufacturing parameter from removal to formation
2Ease of manufacture
If mechanical engraving is used to form fluid channels, then fluid channels are created, but the production cost increases
Solution Approach 1:
The patent substitutes mechanical engraving with stamping, which is a faster and more cost-effective process. The stamping assembly allows for rapid formation of fluid channels without the prolonged machining time and high tooling costs associated with mechanical engraving
Solution Approach 2:
The stamping assembly is designed with pre-formed channel geometries that are directly impressed onto the planar interconnect plate. This preliminary action eliminates the need for sequential machining operations, reducing both time and cost
3Length of stationary object
If conventional methods are used to prepare planar interconnect plates, then fluid channels can be formed, but the plate thickness must be relatively large
Solution Approach 1:
The patent changes the manufacturing method to stamping, which can effectively form fluid channels in thinner plates. The stamping process distributes stress more uniformly and can achieve the desired channel geometry in thinner materials without the risk of tool breakage or excessive processing time associated with engraving thick plates
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method enables the production of thinner, cost-effective modular planar interconnect plates with efficient fluid channels, reducing production time and costs while ensuring full contact between fluids and planar cell units.
Implementation Method 1
stamping the main region of the metal blank sheet to form a plurality of columns of upper protrusions on an upper surface of the main region of the metal blank sheet
Data Source
AI summary
A stamping assembly includes an upper die, a lower die, first pins and second pins. Each of the upper and lower dies has columns of depressions and columns of guiding holes. Each column of the guiding holes is disposed between two adjacent columns of the depressions. The depressions of one of the upper and lower dies are registered with the guiding holes of another one of the upper and lower dies. The first pins and second pins are respectively positioned in the guiding holes of the upper and lower dies and extend outwardly. The first pins and the second pins are respectively arranged into first and second matrices.