Stamped Thermal Management and EMI Shielding for Electronic Devices
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Solution Overview
Problem
Conventional die cast housings for electronic devices are costly, imprecise, have long lead times, and limited design freedom, while also failing to effectively manage heat and electromagnetic interference (EMI) in high-powered integrated circuits.
Innovation Solution
The use of stamped and/or drawn components for thermal management and EMI shielding assemblies, which include pedestals and EMI shields made from high thermal conductivity materials, allowing for improved heat transfer and EMI mitigation without the limitations of die casting, such as reduced costs, increased precision, and enhanced design flexibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If die cast housings are used for thermal management and EMI shielding, then thermal performance can be achieved, but manufacturing cost increases, lead time extends, and design freedom is limited
Solution Approach 1:
The patent replaces expensive die cast housings with stamped metal housings that are cheaper to manufacture and have shorter lead times. The stamped housing achieves comparable thermal performance through integrated thermal management features while being a more economical, disposable-style solution rather than a premium die cast component.
Solution Approach 2:
The patent changes the manufacturing parameter from die casting to stamping, and modifies the housing structure by integrating pedestals and EMI shields as stamped features. This parameter change maintains thermal performance while dramatically reducing manufacturing cost and lead time.
2Temperature
If die cast housings are used for thermal management, then heat transfer can be managed, but manufacturing precision and design flexibility are limited
Solution Approach 1:
The patent segments the housing into functional zones: EMI shield portions, pedestal portions extending toward the heat source, and heat dissipation portions. This segmentation allows each zone to be optimized for its specific function while being manufactured as an integrated stamped component, achieving both precision and flexibility.
Solution Approach 2:
The patent adds dimensional complexity to the stamped housing by creating three-dimensional pedestals and integrated EMI shields within the housing structure. This dimensional enrichment allows precise positioning of thermal and EMI management features without requiring complex die casting molds.
3Object-affected harmful factors
If conventional EMI shields are used separately from thermal management, then EMI shielding can be provided, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent merges EMI shielding, thermal management, and housing functions into a single integrated stamped component. The EMI shield is formed as an integral portion of the housing with pedestals that extend toward the heat source, eliminating the need for separate EMI shield components and reducing overall device complexity.
Solution Approach 2:
The stamped housing serves multiple functions simultaneously: it provides EMI shielding, thermal management through integrated pedestals, structural support, and heat dissipation. This multi-functionality reduces the number of components needed and simplifies the overall device architecture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The stamped components provide thermal performance comparable to die cast housings while reducing costs and lead times, effectively managing heat and EMI, ensuring efficient operation of high-powered integrated circuits.
Implementation Method 1
The heat sink may then be cooled by conventional convection and/or radiation techniques. During conduction, the heat may pass from the operating electrical component to the heat sink
Implementation Method 2
The thermal interface material may be used to fill the gap between thermal transfer surfaces, in order to increase thermal transfer efficiency as compared to having the gap filled with air, which is a relatively poor thermal conductor.
Implementation Method 3
A common solution to ameliorate the effects of EMI/RFI is through the use of shields capable of absorbing and/or reflecting and/or redirecting EMI energy.
Implementation Method 4
A common solution to ameliorate the effects of EMI/RFI is through the use of shields capable of absorbing and/or reflecting and/or redirecting EMI energy.
Data Source
AI summary
Disclosed are exemplary embodiments of thermal transfer/management and electromagnetic interference (EMI) shielding/mitigation solutions, systems, and/or assemblies for electronic devices. Also disclosed are methods of making or manufacturing (e.g., stamping, drawing, etc.) components of the thermal transfer/management and EMI shielding/mitigation solutions, systems, and/or assemblies.