Substrate Mounting Stand Cleaning Position Adjustment
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Solution Overview
Problem
Existing substrate processing apparatuses face challenges in achieving uniform cleaning due to uneven diffusion of cleaning gases, leading to potential over-etching or insufficient cleaning of the substrate mounting stand.
Innovation Solution
A substrate processing apparatus is designed with a process chamber that includes a rotating substrate mounting stand, multiple gas supply units for precursor and reaction gases, and a dedicated cleaning gas supply unit, along with an elevating mechanism to maintain the stand at different positions for optimal gas exposure and cleaning, ensuring even gas distribution and uniform cleaning.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If cleaning gas is supplied from above the substrate mounting stand in a confined space, then gas use efficiency is improved and gases are not mixed, but cleaning uniformity deteriorates due to uneven diffusion
Solution Approach 1:
The substrate mounting stand is moved vertically to a cleaning position where the distance between the gas supply holes and the stand surface is increased. This dimensional change (from horizontal confinement to vertical expansion) allows cleaning gas to diffuse more uniformly across the stand surface while still maintaining gas efficiency through the controlled vacuum environment.
Solution Approach 2:
The distance parameter between the gas supply holes and the substrate mounting stand surface is changed from a short distance (during processing) to a long distance (during cleaning). This parameter change enables the cleaning gas to spread more evenly across the stand surface, achieving uniform cleaning while the vacuum system maintains overall gas efficiency.
2Quantity of substance
If gas supply space is confined below gas supply holes, then gas exposure amount is increased, but cleaning gas diffusion is restricted leading to over-etching or insufficient cleaning
Solution Approach 1:
The system dynamically adjusts the position of the substrate mounting stand between two states: a processing position for film formation with short gas exposure distance, and a cleaning position for uniform cleaning with long gas exposure distance. This dynamic positioning allows the same system to optimize for different operational requirements.
Solution Approach 2:
The cleaning process is segmented from the film formation process by physically moving the substrate mounting stand to a dedicated cleaning position. This segmentation allows the cleaning gas to diffuse uniformly across the stand surface without the constraints of the confined processing space, achieving thorough and even cleaning.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables uniform and efficient cleaning of the substrate mounting stand by controlling gas flow and pressure, preventing over-etching and ensuring thorough cleaning, thereby maintaining process integrity and equipment longevity.
Implementation Method 1
a cleaning gas in a plasma state may be supplied into a process chamber
Data Source
AI summary
There is provided a technique that includes: loading substrates into a process chamber and mounting the substrates on a substrate mounting stand, which is installed in the process chamber, along a circumferential direction; maintaining the substrate mounting stand at a substrate processing position; processing the substrates on the substrate mounting stand, which is maintained at the substrate processing position, by supplying a first gas and a second gas from a first gas supply unit and a second gas supply unit, respectively, arranged above the substrate mounting stand while rotating the substrate mounting stand; unloading the substrates from the process chamber; maintaining the substrate mounting stand at a cleaning position; and cleaning the substrate mounting stand, which is maintained at the cleaning position, by supplying a cleaning gas from a third gas supply unit arranged above the substrate mounting stand, wherein the cleaning position is lower than the substrate processing position.