Standard Cell Fin Layout Around Power Rail Boundaries
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Solution Overview
Problem
The increasing demand for high-performance, high-speed, and multifunctional semiconductor devices has led to challenges in achieving improved integration density and reliability, particularly in the design and manufacturing processes of semiconductor devices.
Innovation Solution
The semiconductor device incorporates a substrate with specific arrangements of standard cells and power supply lines, including active fins and power supply lines that extend along boundaries between row regions, with active fins spaced apart to avoid overlapping these boundaries, and the use of dummy fins to enhance design flexibility and integration density.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If active fins are arranged densely to increase integration density, then integration density is improved, but reliability deteriorates due to potential overlapping with power supply lines and increased manufacturing complexity
Solution Approach 1:
The active region is divided into multiple row regions separated by boundaries, with power supply lines positioned along these boundaries. Active fins within each row region are spaced to avoid overlapping boundaries, creating segmented zones that maintain both high density and reliability.
Solution Approach 2:
Different spacing requirements are applied to active fins based on their local position: fins near boundaries are spaced farther apart to avoid overlapping power supply lines, while fins in the center of row regions can be more densely packed, optimizing both reliability and integration density locally.
2Manufacturing precision
If power supply lines are positioned along boundaries between row regions, then manufacturing precision is improved by simplifying alignment, but device complexity increases due to the need for precise boundary definition
Solution Approach 1:
The boundaries between row regions serve multiple functions: they define the edges of active fin arrangements, position power supply lines, and act as reference lines for manufacturing alignment. This multi-functionality simplifies the manufacturing process while maintaining precise positioning.
3Reliability
If active fins are spaced apart to avoid overlapping boundaries, then reliability is improved, but area utilization deteriorates reducing integration density
Solution Approach 1:
Active fins are spaced apart only in the regions necessary to avoid overlapping power supply lines at boundaries, while maintaining maximum density in the central regions of each row. This partial application of spacing ensures reliability without excessive loss of area utilization.
Data Source
AI summary
A semiconductor device includes a substrate having an active region, first standard cells arranged in a first row on the active region, second standard cells arranged in a second row on the active region and having a first boundary with the first standard cells, a third standard cells arranged in a third row on the active region and having a second boundary with the first standard cells, and a plurality of power supply lines, respectively arranged along boundaries. Each of the first to third standard cells includes a plurality of fin patterns extending in the first direction, and the plurality of fin patterns are arranged in a second direction, so as not to be disposed on at least one boundary, among the first and second boundaries.