Standard-Cell I/O Layout Around TSV Keep-Out Zones
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Solution Overview
Problem
The area occupied by input/output (I/O) interface cells in stacked semiconductor devices is larger than that of logic cells, limiting the efficient disposition of logic cells and increasing the overall size of the semiconductor device.
Innovation Solution
Implementing I/O interface cells in a standard cell type, where the driver circuit and ESD diode are adjacent to logic cells, and using a layout finishing cell region to surround the Keep-Out Zone and TSV, allowing logic cells to be adjacent to the I/O interface cells and reducing the occupied area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If I/O interface cells are implemented with separate layout (non-standard cell type), then the driver circuit and ESD diode can be properly isolated and protected, but the area occupied by I/O interface cells becomes larger
Solution Approach 1:
The patent merges the I/O interface cell with the standard cell layout structure. The driver circuit and ESD diode are integrated into the standard cell grid, allowing them to share space with logic cells while maintaining proper isolation through the standard cell design rules and KOZ requirements. This combining approach reduces the overall area by eliminating separate dedicated regions for I/O components.
Solution Approach 2:
The standard cell layout is designed to serve multiple functions simultaneously. The same cell structure accommodates both logic cells and I/O interface cells, with the driver circuit and ESD diode sharing the standardized layout framework. This universal design allows the I/O interface cell to perform both I/O functions and fit within the standard cell area constraints.
2Ease of manufacture
If I/O interface cells occupy larger area, then the driver circuit and ESD diode can be properly disposed with sufficient spacing, but the number of logic cells that can be disposed decreases
Solution Approach 1:
The I/O interface cell is segmented into functional regions within the standard cell layout. The driver circuit, ESD diode, and TSV are positioned in specific segments that satisfy spacing requirements while fitting within the standardized cell dimensions. This segmentation allows proper disposition of components without exceeding the standard cell area, thereby maintaining high cell density.
Solution Approach 2:
The patent utilizes the vertical dimension and layered structure of standard cell layout to accommodate driver circuit and ESD diode components. By arranging components in different layers and utilizing vertical spacing, the design achieves sufficient separation between driver circuit and ESD diode while maintaining a compact footprint that allows more logic cells to be disposed in the horizontal plane.
3Area of stationary object
If I/O interface cells are reduced in area, then more logic cells can be disposed efficiently, but the Keep-Out Zone and ESD diode layout becomes more constrained
Solution Approach 1:
The patent applies local quality by implementing the KOZ and ESD diode layout constraints only in the specific regions where they are required, rather than applying uniform constraints across the entire I/O interface cell. The driver circuit is positioned adjacent to the KOZ with appropriate spacing, and the ESD diode is disposed in a location that satisfies local electrical isolation requirements without unnecessarily constraining the overall cell area.
4Area of stationary object
If standard cell type layout is used for I/O interface cells, then area is reduced and logic cells can be adjacent to I/O interface cells, but the driver circuit must be disposed adjacent to the layout finishing cell region
Solution Approach 1:
The layout finishing cell region serves as an intermediary structure that mediates between the driver circuit and the standard cell array. The driver circuit is disposed adjacent to the layout finishing cell region, which acts as a buffer and transition zone. This intermediary structure allows the driver circuit to be properly positioned while maintaining the standard cell type layout for the I/O interface cell, thus reducing area while managing the disposition constraints.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces the area occupied by I/O interface cells, enabling more efficient use of the semiconductor device area and allowing for the deployment of additional logic cells, thereby minimizing waste and improving signal transmission performance in 3D-IC packages.
Implementation Method 1
an electrostatic discharge (ESD) diode on an upper surface of the substrate
Implementation Method 2
a through silicon via (TSV) penetrating through the substrate, the TSV being surrounded by the KOZ
Data Source
Figure 1~2
Figure 3
Figure 4
AI summary
A semiconductor device may include a substrate including a Keep-Out Zone (KOZ) and a layout finishing cell region, a through silicon via (TSV) penetrating the substrate and surrounded by the KOZ; an ESD diode on an upper surface of the substrate, a driver circuit, gate structures, and metal wirings electrically connecting the TSV, the ESD diode, and the driver circuit. The layout finishing cell region may surround the KOZ and the ESD diode. The driver circuit may be adjacent to and outside the layout finishing cell region. The substrate may include active regions extending from an end inside the layout finishing cell region. The gate structures may intersect the active regions to form semiconductor components. The driver circuit may include at least some of the semiconductor components.